Biodegradable materials represent a promising path toward green and sustainable electronics on a global scale in the future. Plastics play a pivotal role in contemporary electronics, including printed circuit boards (PCB), where petroleum‐based polymers such as epoxies form the base insulating substrate. In this review paper, several promising bio‐based alternatives to conventional PCB materials that are recently developed and investigated are stated and discussed regarding their properties, practical utilization, and further perspective. The given list includes polylactic acid (PLA), cellulose acetate (CA), polyvinyl alcohol (PVA), and others, with the development of PLA‐based PCB substrates being the furthest along regarding the use in industry practice. Yet, all of the provided solutions are still only suitable for prototypes or low‐cost electronics without high‐reliability requirements. The reason for this is inferior mechanical and thermal properties of biopolymers compared to traditional petroleum‐based polymers. Further development is therefore essential, including new types of reinforcements and other additives. However, as Life Cycle Assessment analyses discussed in the paper show, biopolymers are capable of significantly reducing the environmental impact and are likely to play a major role in shaping a sustainable path for the electronics industry, which will be a key challenge in the current decade.

Advances in Producing Functional Circuits on Biodegradable PCBs

In this paper, we investigated the applicability of ChatGPT AI in electronics research and development via a case study of applied sensors in embedded electronic systems, a topic that is rarely mentioned in the recent literature, thus providing new insight for professionals and academics. The initial electronics-development tasks of a smart home project were prompted to the ChatGPT system to find out its capabilities and limitations. We wanted to obtain detailed information on the central processing controller units and the actual sensors usable for the specific project, their specifications and recommendations on the hardware and software design flow additionally. Furthermore, an extensive literature survey was requested to see if the bot could offer scientific papers covering the given topic. It was found that the ChatGPT responded with proper recommendations on controllers. However, the suggested sensor units, the hardware and software design were only partially acceptable, with occasional errors in specifications and generated code. The results of the literature survey showed that non-acceptable, fabricated citations (fake authors list, title, journal details and DOI—Digital Object identifier) were presented by the bot. The paper provides a detailed qualitative analysis, a performance analysis and critical discussion of the aforementioned aspects while providing the query set, the generated answers and codes as supplied data with the goal to give added value to electronics researchers and developers if trying to reach out for the tools in their profession.

Biodegradables are a promising path for the future of electronics in a greener mindset. The review study focuses on their applications and past and current research results. The paper also investigates the application of nanomaterials as fillers to control or increase the physical (electrical, mechanical, thermal) properties of biodegradable biopolymers. These biodegradables and nanocomposites are already effectively used in prototypes and advanced application areas with demanding requirements, such as flexible and wearable electronics, implantable or biomedical applications, and traditional commercial electronics. The nano-enhanced biopolymer substrates (e.g., with improved gas and water barrier functionalities) sometimes also with integrated, nano-enabled functionalities (such as electromagnetic shielding or plasmonic activity) can be beneficial in many electronics packaging and nanopackaging applications as well.

Purpose: – The paper aims to present a comparative study of various thermocouple (TC) attaching methods for the proper measurement of soldering temperature profiling during vapour phase soldering (VPS). The heat transfer process during VPS is different from common methods, while the required heat for reflow is provided by the condensation. The condensate is a flowing layer on the board, where the dynamic behaviour also affects the local conditions on the surfaces. Temperature measurements based on TCs are also affected this way; it is important to investigate the process for deeper understanding. Design/methodology/approach: – Bare printed circuit boards (PCBs) were prepared for standard K-Type TCs attachment with industry standard materials: kapton polyimide tape, aluminium tape, SMD adhesive and high-temperature solder (HTS). Heating experiments were performed in a batch-type VPS oven with Galden LS240 fluid and fixed oven parameters. Findings: – According to the specific attachment requirements, HTS and Alu-tape are the suggested methods for better profiling reliability and repeatability. Alu-tape is the preferred all-around method, for fast, exchangeable, cheap, reliable and repeatable profiling in a VPS oven. It was presented that the heating factor (Q?) gives more reliable comparison overview; the time period-based comparisons may be affected by the thermal inertia, while heating factor also includes temperature conditions at the given time points. Originality/value: – The paper presents the reliability of the presented methods for VPS and present suggestions for the use of different TC ends and attaching materials during condensation heating of the PCBs. Also a new approach on profiling data evaluation based on the heating factor is presented and suggested for wider use.