This study investigates the mechanism and effects of incorporating different ZrO₂ nano-particles into SAC0307 solder alloys. ZrO₂ nano-powder and nano-fibers in 0.25–0.5 wt% were added to the SAC0307 alloy to prepare composite solder joints by surface mount technology. The solder joints were shear tested before and after a 4000 h long 85 °C/85% RH corrosive reliability test. The incorporation of ZrO₂ nano-particles enhanced the initial shear force of the solder joint, but they decreased the corrosion resistance in the case of 0.5 wt%. SEM, EDS, and FIB analysis revealed intensive growth of SnO₂ on the solder joint surfaces, leading to the formation of Sn whiskers. Density functional theory (DFT) simulations showed that, despite Sn being able to bond to the surface of ZrO₂, the binding energy was weak, and the whole system was therefore unstable. It was also found that ZrO₂ nano-particles refined the microstructure of the solder joints. Decreased β-Sn grain size and more dispersed intermetallic compounds were observed. The microstructural refinement caused mechanical improvement of the ZrO₂ composite solder joints by dispersion strengthening but could also decrease their corrosion resistance. While ZrO₂ nano-particles improved the solder joint mechanical properties, their use is recommended only in non-corrosive environments, such as microelectronics for space applications.

Soldering with Sn alloys has always been the essential assembly step of microelectronics. The conductive Sn whiskers, which can spontaneously grow from soldering surfaces, mean a considerable reliability risk for microelectronics due to possible short circuit formation between the leads of the components. Since their discovery in 1951, thousands of research studies have been conducted to unravel their growth mechanisms and find effective prevention methods against them. Till 2006, the Sn whisker problem was solved and partially forgotten due to the very effective whisker suppression effect of Pb alloying into the solder materials. The lead-free change gave new impetus to the problem, which was further enhanced by the application of new material systems, growing reliability requirements, and accelerating miniaturization in the 21st century. Our review would like to give an overview of the Sn whisker’s history from the beginning till the latest results, focusing on the suppression solutions by the modification of the solder alloy compositions. Recently, promising results have been reached by alloying Bi and In, which are metals that are the focus of low-temperature soldering, and by composite solders.