Methoxyl-capped MQ silicone resin (MMQ) was first synthesized by the hydrosilylation of vinyl-containing MQ silicone resin and trimethoxysilane and then used in condensed room-temperature vulcanized (RTV) silicone rubber as a self-reinforced cross-linker. Results show that modified silicone rubber exhibits good light transmission. Compared with unmodified silicone rubber, the hardness, tensile strength and elongation of MMQ at the break are increased by 26.4 A, 2.68 MPa and 65.1%, respectively. In addition, the characteristic temperature of 10% mass loss is delayed from 353.5 °C to 477.1 °C, the temperature at maximum degradation rate is also delayed from 408.9 °C to 528.4 °C and the residual mass left at 800 °C is increased from 1.2% to 27.7%. These improved properties are assigned to the synergistic effect of the rigid structure of MMQ, the formation of a dense cross-linking structure in polymers and the uniform distribution of MMQ cross-linking agent in RTV silicone rubber.

With developments of the electronics industry, more components are being included in electronic devices, which has led to challenges in thermal management. Using reduced graphene oxide embedded with MQ silicone resin (RGO/MQ) nano-aggregates as the composite filler and silicone rubber (SR) as the matrix, a simple approach is designed to prepare RGO/MQ/SR composites. Reduced graphene oxide (RGO) was first used as a substrate for the growth of MQ silicone resin by hybridization, forming sandwich-like micro structured RGO/MQ nano-aggregates successfully. Then, RGO/MQ was integrated into α,ω-dihydroxylpolydimethylsiloxane based on the in situ solvent-free blending method, followed by condensation and vulcanization, fabricating the final RGO/MQ/SR composites. The effective strategy could enhance the adaptability between graphene and silicone matrix under external stimuli at room temperature by embedding nanoscale MQ into the interface of graphene/silicone as the buffer layer. Obvious improvements were found in both thermal conductivity and mechanical properties due to excellent dispersion and interfacial compatibility of RGO/MQ in the host materials. These attractive results suggest that this RGO/MQ/SR composite has potential as a thermal interface material for heat dissipation applications.