This paper demonstrates and compares different experimental techniques utilized to estimate the quality factor (Q) and natural frequency from non-contact measurements of Microelectromechanical Systems (MEMS) motions. The relative merits of those techniques are contrasted in Q factor estimation for a cantilever beam MEMS actuator, operated in three configurations: free standing, arc-shaped, and s-shaped. It is found that damping estimation techniques that seek to minimize the deviation between the response of an “assumed” linear oscillator and the measured time-history of the motions are superior to those traditional techniques, such as logarithmic decrement and half-power bandwidth. Further, it is found that Q increases three-fold as the actuator contact with the substrate evolves from a line to an area.

Conventional packaging and interconnection methods for two-terminal devices, e.g., diodes often involve expensive and bulky equipment, introduce parasitic effects and have reliability issues. In this study, we propose a built-in packaging method and evaluate its performance compared to probing and wire bonding methods. The built-in packaging approach offers a larger overlap area, improved contact resistance, and direct connection to testing equipment. The experimental results demonstrate a 12% increase in current, an 11% reduction in resistance, and improved performance of the diode. The proposed method is promising for enhancing sensing applications, wireless power transmission, energy harvesting, and solar rectennas. Overall, the built-in packaging method offers a simpler, cheaper, more compact and more reliable packaging solution, paving the way for more efficient and advanced technologies in these domains.

Cellular polypropylene (PP) has been recently used in energy harvesting applications. In this work, we investigate its viability and long-term stability under various operating conditions. Specifically, the effect of constant stress and stress cycling on output power and long-term stability of ferroelectret energy harvesters is analyzed. Our findings show that after 112 days constant stress significantly increases the piezoelectric charge constant $d_{33}$ and output power from 0.51 μW for a stress-free harvester to 2.71 μW. It also increases the harvester center frequency from 450 to 700 Hz and decreases its optimal resistance from 7 to 5.5 M $\mathsf{\Omega }$ .

An alternative packaging method, termed built-in packaging, is proposed for single terminal devices, and demonstrated with an actuator application. Built-in packaging removes the requirements of wire bonding, chip carrier, PCB, probe station, interconnection elements, and even wires to drive single terminal devices. Reducing these needs simplifies operation and eliminates possible noise sources. A micro resonator device is fabricated and built-in packaged for demonstration with electrostatic actuation and optical measurement. Identical actuation performances are achieved with the most conventional packaging method, wire bonding. The proposed method offers a compact and cheap packaging for industrial and academic applications.

Enhancing the output power of triboelectric nanogenerators (TENGs) requires the creation of micro or nano-features on polymeric triboelectric surfaces to increase the TENGs’ effective contact area and, therefore, output power. We deploy a novel bench-top fabrication method called dynamic Scanning Probe Lithography (d-SPL) to fabricate massive arrays of uniform 1 cm long and 2.5 µm wide nano-features comprising a 600 nm deep groove (NG) and a 600 nm high triangular prism (NTP). The method creates both features simultaneously in the polymeric surface, thereby doubling the structured surface area. Six thousand pairs of NGs and NTPs were patterned on a $6\times 5$ cm${}^2$ PMMA substrate. It was then used as a mold to structure the surface of a 200 µm thick Polydimethylsiloxane (PDMS) layer. We show that the output power of the nano-structured TENG is significantly more than that of a TENG using flat PDMS films, at 12.2 mW compared to 2.2 mW, under the same operating conditions (a base acceleration amplitude of 0.8 g).