Herein, the authors present a new defect formation mechanism related to the laser wavelength. Short pulse width lasers only modify the surface layer, resulting in core-shell defective TiO ₂ . Unlike long pulse lasers, the bulk of particles remains unchanged.

Borophene and silicene, two novel members of the Xene family, feature high surface reactivity and stability suitable for sensing applications. However, the

Conventional packaging and interconnection methods for two-terminal devices, e.g., diodes often involve expensive and bulky equipment, introduce parasitic effects and have reliability issues. In this study, we propose a built-in packaging method and evaluate its performance compared to probing and wire bonding methods. The built-in packaging approach offers a larger overlap area, improved contact resistance, and direct connection to testing equipment. The experimental results demonstrate a 12% increase in current, an 11% reduction in resistance, and improved performance of the diode. The proposed method is promising for enhancing sensing applications, wireless power transmission, energy harvesting, and solar rectennas. Overall, the built-in packaging method offers a simpler, cheaper, more compact and more reliable packaging solution, paving the way for more efficient and advanced technologies in these domains.