We investigate the rich potential of the multi-modal motions of electrostatically actuated asymmetric arch microbeams to design higher sensitivity and signal-to-noise ratio (SNR) inertial gas sensors. The sensors are made of fixed–fixed microbeams with an actuation electrode extending over one-half of the beam span in order to maximize the actuation of asymmetry. A nonlinear dynamic reduced-order model of the sensor is first developed and validated. It is then deployed to investigate the design of sensors that exploit the spatially complex and dynamically rich motions that arise due to veering and modal hybridization between the first symmetric and the first anti-symmetric modes of the beam. Specifically, we compare among the performance of four sensors implemented on a common platform using four detection mechanisms: classical frequency shift, conventional bifurcation, modal ratio, and differential capacitance. We find that frequency shift and conventional bifurcation sensors have comparable sensitivities. On the other hand, modal interactions within the veering range and modal hybridization beyond it offer opportunities for enhancing the sensitivity and SNR of bifurcation-based sensors. One method to achieve that is to use the modal ratio between the capacitances attributed to the symmetric and asymmetric modes as a detector, which increases the detection signal by three orders of magnitude compared to a conventional bifurcation sensor. We also present a novel sensing mechanism that exploits a rigid arm extending transversely from the arch beam mid-point and placed at equal distances between two side electrodes. It uses the asymmetry of the arch beam motions to induce rotary motions and realize a differential sensor. It is found to increase the detection signal by two orders of magnitude compared to a conventional bifurcation sensor.

Conventional packaging and interconnection methods for two-terminal devices, e.g., diodes often involve expensive and bulky equipment, introduce parasitic effects and have reliability issues. In this study, we propose a built-in packaging method and evaluate its performance compared to probing and wire bonding methods. The built-in packaging approach offers a larger overlap area, improved contact resistance, and direct connection to testing equipment. The experimental results demonstrate a 12% increase in current, an 11% reduction in resistance, and improved performance of the diode. The proposed method is promising for enhancing sensing applications, wireless power transmission, energy harvesting, and solar rectennas. Overall, the built-in packaging method offers a simpler, cheaper, more compact and more reliable packaging solution, paving the way for more efficient and advanced technologies in these domains.

An alternative packaging method, termed built-in packaging, is proposed for single terminal devices, and demonstrated with an actuator application. Built-in packaging removes the requirements of wire bonding, chip carrier, PCB, probe station, interconnection elements, and even wires to drive single terminal devices. Reducing these needs simplifies operation and eliminates possible noise sources. A micro resonator device is fabricated and built-in packaged for demonstration with electrostatic actuation and optical measurement. Identical actuation performances are achieved with the most conventional packaging method, wire bonding. The proposed method offers a compact and cheap packaging for industrial and academic applications.

A novel MEMS continuous deformable mirror (DM) is presented. The mirror can be integrated into optical systems to compensate for monochromatic and chromatic aberrations. It is comprised of a 1.6 mm circular plate supported by eight evenly spaced flexural springs. Unlike traditional bias actuated DMs, it uses resonant electrostatic actuation (REA) to realize low- and high-order Zernike modes with a single drive signal. Instead of the hundreds or thousands of electrodes deployed by traditional DMs, the proposed DM employs only 49 electrodes and eliminates the need for spatial control algorithms and associated hardware, thereby providing a compact low-cost alternative. It also exploits dynamic amplification to reduce power requirements and increase the stroke by driving the DM at resonance. The DM was fabricated using a commercial silicon-on-insulator (SOI) MEMS process. Experimental modal analysis was carried out using laser Doppler vibrometry (LDV) to identify mode shapes of the DM and their natural frequencies. We are able to observe all of the lowest eight Zernike modes.

Enhancing the output power of triboelectric nanogenerators (TENGs) requires the creation of micro or nano-features on polymeric triboelectric surfaces to increase the TENGs’ effective contact area and, therefore, output power. We deploy a novel bench-top fabrication method called dynamic Scanning Probe Lithography (d-SPL) to fabricate massive arrays of uniform 1 cm long and 2.5 µm wide nano-features comprising a 600 nm deep groove (NG) and a 600 nm high triangular prism (NTP). The method creates both features simultaneously in the polymeric surface, thereby doubling the structured surface area. Six thousand pairs of NGs and NTPs were patterned on a $6\times 5$ cm${}^2$ PMMA substrate. It was then used as a mold to structure the surface of a 200 µm thick Polydimethylsiloxane (PDMS) layer. We show that the output power of the nano-structured TENG is significantly more than that of a TENG using flat PDMS films, at 12.2 mW compared to 2.2 mW, under the same operating conditions (a base acceleration amplitude of 0.8 g).