Prof. Dylan J. Colvin is a researcher at the Florida Solar Energy Center, University of Central Florida. He received his B.S. in Mechanical Engineering (2019) and Ph.D. in Materials Science and Engineering (2022) from the University of Central Florida. He began working in photovoltaic (PV) module reliability and characterization in 2017. When he started at FSEC in 2018, he worked on providing characterization services for projects funded by the U.S. Department of Energy and national laboratories in collaboration with local utilities, module manufacturers, and test equipment manufacturers. During this time, he was co-developing an electroluminescence (EL) analysis technique and a method to extract cell and polymer samples from PV modules. He manages FSEC's PV Module Characterization Facility. His current research focuses on studying multi-modal root-cause analysis, ultraviolet fluorescence (UVF) image analysis, PV data ontology development, PID-p degradation in bifacial PV modules, and thin-film module reliability. He is an active member of IEEE.
Prof. Dylan J. Colvin is a researcher at the Florida Solar Energy Center, University of Central Florida. He received his B.S. in Mechanical Engineering (2019) and Ph.D. in Materials Science and Engineering (2022) from the University of Central Florida. He began working in photovoltaic (PV) module reliability and characterization in 2017. When he started at FSEC in 2018, he worked on providing characterization services for projects funded by the U.S. Department of Energy and national laboratories in collaboration with local utilities, module manufacturers, and test equipment manufacturers. During this time, he was co-developing an electroluminescence (EL) analysis technique and a method to extract cell and polymer samples from PV modules. He manages FSEC's PV Module Characterization Facility. His current research focuses on studying multi-modal root-cause analysis, ultraviolet fluorescence (UVF) image analysis, PV data ontology development, PID-p degradation in bifacial PV modules, and thin-film module reliability. He is an active member of IEEE.