This paper presents a compact model of mutual inductance between two planar inductors, which is essential to design and optimize a wireless power transmission system. The tracks of the planar inductors are modeled as constant current carrying filaments, and the mutual inductance between individual filaments is determined by Neumann's integral. The proposed model is derived by solving Neumann's integral using a series expansion technique. This model can predict the mutual inductance at various axial and lateral displacements. Mutual coupling between planar inductors is computed by a 3-D electromagnetic (EM) solver, and the proposed model shows good agreement with these numerical results. Different types of planar inductors were fabricated on a printed circuit board (PCB) or silicon wafer. Using these inductors, wireless power links were constructed for applications like implantable biomedical devices and contactless battery charging systems. Mutual inductance was measured for each of the cases, and the comparison shows that the proposed model can predict mutual coupling suitably.

A high slew-rate amplifier with push-pull output driving capability is proposed to enable an ultra-low quiescent current (Iq ~ 1muA) low-dropout (LDO) regulator with improved transient responses. The proposed amplifier eliminates the tradeoff between small Iq and large slew-rate that is imposed by the tail-current in conventional amplifier design. Push-pull output stage is introduced to enhance the output driving ability. Small dropout voltage (Vbo) with large-size pass transistor and ultra-low Iq can thus be used to minimize power loss of LDO regulator without transient-response degradation. The proposed amplifier helps to improve stability of LDO regulators without using any on-chip and off-chip compensation capacitors. This is beneficial to chip-level power management requiring high-area efficiency. An LDO regulator with the proposed amplifier has been implemented in a 0.18- mum standard CMOS process and occupies 0.09 mm². The LDO regulator can deliver 50-mA load current at 1-V input and ~ 100-mV V_DO . It only consumes 1.2 muA Iq and is able to recover within ~ 4 mus even under the worst case scenario.

The design issues of a single-transistor-control (STC) low-drop-out (LDO) based on flipped voltage follower is discussed in this paper, in particular the feedback stability at different conditions of output capacitors, equivalent series resistances (ESRs) and load current. Based on the analysis, an STC LDO was implemented in a standard 0.35-mum MOS technology. It is proven experimentally that the LDO provides stable voltage regulation at a variety of output-capacitor/ESR conditions and is also stable in no output capacitor condition. The preset output voltage, minimum unregulated input voltage, maximum output current at a dropout voltage of 200 mV, ground current and active chip area are 1 V, 1.2 V, 50 mA, 95 muA, and 140 mum times 320 mum, respectively. The full-load transient response in the no output capacitor case is faster than a micro second and is about 300 ns.

A dual-material-gate junctionless nanowire transistor (DMG-JNT) is proposed in this paper. Its characteristic is demonstrated and compared with a generic single-material-gate JNT using 3-D numerical simulations. The results show that the DMG-JNT has a number of desirable features, such as high ON-state current, a large ON/OFF current ratio, improved transconductance G_m, high unity-gain frequency f_T, high maximum oscillation frequency f_MAX, and reduced drain-induced barrier lowering. The effects of different control gate ratios Ra and varied work-function differences between the two gates are studied. Finally, the optimization of Ra and the work-function difference for the proposed DMG-JNT is presented.

A new physical and continuous BSIM (Berkeley Short-Channel IGFET Model) I-V model in BSIM3v3 is presented for circuit simulation. Including the major physical effects in state-of-the art MOS devices, the model describes current characteristics from subthreshold to strong inversion as well as from the linear to the saturation operating regions with a single I-V expression, and guarantees the continuities of I/sub ds/, conductances and their derivatives throughout all V/sub gs/, V/sub ds/, and T/sub bs/, bias conditions. Compared with the previous BSIM models, the improved model continuity enhances the convergence property of the circuit simulators. Furthermore, the model accuracy has also been enhanced by including the dependencies of geometry and bias of parasitic series resistances, narrow width, bulk charge, and DIBL effects. The new model has the extensive built-in dependencies of important dimensional and processing parameters (e.g., channel length, width, gate oxide thickness, junction depth, substrate doping concentration, etc.). It allows users to accurately describe the MOSFET characteristics over a wide range of channel lengths and widths for various technologies, and is attractive for statistical modeling. The model has been implemented in the circuit simulators such as Spectre, Hspice, SmartSpice, Spice3e2, and so on.