This paper proposes a broadband asymmetrical monolithic microwave integrated circuit (MMIC) Doherty power amplifier (DPA) using 0.25-μm gallium-nitride process with a compact chip size of 2.37 × 1.86 mm² for 5G communication. It adopts an unequal Wilkinson’s power divider with a ratio of 2.5:1, where 71.5% of the total power is transferred to the main amplifier for higher gain. Different input matching networks are used to offset phase difference while completing impedance conversion. This design also applies a novel topology to solve the problem of large impedance transformer ratio (ITR) in conventional DPA, and it optimizes the ITR from 4:1 to 2:1 for wider band. Moreover, most of the components of the DPA including power divider and matching networks use lumped inductors and capacitors instead of long transmission line (TL) for a smaller space area. The whole circuit is designed and simulated using Agilent’s advanced design system (ADS). The simulated small-signal gain of DPA is 8–11 dB and the saturation output power is more than 39.5 dBm with 800 MHz band from 4.5 GHz to 5.3 GHz. At 6-dB output power back-off, the DPA demonstrates 38–41.3% power added efficiency (PAE), whereas 44–54% PAE is achieved at saturation power.

The influence of the repair process on the electrical properties of the normally off p-GaN high-electron-mobility transistor (HEMT) is studied in detail in this paper. We find that the etching process will cause the two-dimensional electron gas (2DEG) and the mobility of the p-GaN HEMT to decrease. However, the repair process will gradually recover the electrical properties. We study different repair methods and different repair conditions, propose the best repair conditions, and further fabricate the p-GaN HEMTs devices. The threshold voltage of the fabricated device is 1.6 V, the maximum gate voltage is 7 V, and the on-resistance is 23 Ω·mm. The device has a good performance, which proves that the repair conditions can be successfully applied to the fabricate of the p-GaN HEMT devices.

A comprehensive study of proton irradiation reliability on a bilayer dielectrics SiN_x/Al₂O₃ MIS-HEMT, the common Schottky gate HEMT, and a single dielectric layer MIS-HEMT with SiN_x and with Al₂O₃ for comparison is conducted in this paper. Combining the higher displacement threshold energy of Al₂O₃ with the better surface passivation of the SiN_x layer, the bilayer dielectrics MIS-HEMT presents much smaller degradation of structural materials and of device electrical performance after proton irradiation. Firstly, the least of the defects caused by irradiation suggesting the smallest structural material degradation is observed in the bilayer dielectrics MIS-HEMT through simulations. Then, DC and RF electrical performance of four kinds of devices before and after proton irradiation are studied through simulation and experiments. The smallest threshold voltage degradation rate, the smallest maximum on-current degradation and Gm degradation, the largest cut-off frequency, and the lowest cut-off frequency degradation are found in the bilayer dielectrics MIS-HEMT among four kinds of devices. The degradation results of both structural materials and electrical performance reveal that the bilayer dielectrics MIS-HEMT performs best after irradiation and had better radiation resilience.

The GaN photoconductive semiconductor switches (PCSSs) with low leakage current and large on-state current are suitable for several applications, including fast switching and high-power electromagnetic pulse equipment. This paper demonstrates a high-power GaN lateral PCSS device. An output peak current of 142.2 A is reached with an input voltage of 10.28 kV when the GaN lateral PCSS is intrinsically triggered. In addition, the method of retaining the AlGaN/GaN heterostructure between electrodes on PCSSs is proposed, which results in increasing the output peak current of the PCSS. The damage mechanism of the PCSS caused by a high electric field and high excitation laser energy is analyzed. The obtained results show that the high heat generated by the large current leads to the decomposition of GaN, and thus, the Ga forms a metal conductive path, resulting in the failure of the device.