Shenglin Ma is Associate Professor in the Department of Mechanical and Electrical Engineering at Xiamen University, China. He received his PhD from Peking University and has also been a guest researcher with the National Key Laboratory of Science and Technology in Micro/Nano Fabrication at Peking University. He has over 50 publications and 20 patents to his name, and his research focuses on TSV-based 3D integration technology, MEMS and their applications.
Research Keywords & Expertise
Microsystems
Wafer Bonding
3D integration
Through silicon vias (...
Fingerprints
29%
Through silicon vias (TSVs)
13%
3D integration
8%
Wafer Bonding
6%
Microsystems
Short Biography
Shenglin Ma is Associate Professor in the Department of Mechanical and Electrical Engineering at Xiamen University, China. He received his PhD from Peking University and has also been a guest researcher with the National Key Laboratory of Science and Technology in Micro/Nano Fabrication at Peking University. He has over 50 publications and 20 patents to his name, and his research focuses on TSV-based 3D integration technology, MEMS and their applications.
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