Prof. Dr. Lijun Wang received a B.S. degree in Semiconductor Devices and an M.S. degree in Semiconductor Physics and Device Physics from Jilin University, Changchun, China, in 1973 and 1982, respectively. From 1986 to 1999, he worked with the Changchun Institute of Physics, Chinese Academy of Sciences. He has been working with the Changchun Institute of Optics, Mechanics, and Physics (CIOMP), Chinese Academy of Sciences, since 1999. He was elected an Academician of the Chinese Academy of Sciences, in 2013. He has long been engaged in basic and applied research in laser technology and other fields. He led his research team to break through the old framework of their predecessors and theoretically clarify the feasibility of the operation of a watt-level high-power vertical-cavity surface-emitting laser. New structures and design concepts, such as multi-gain regions, were proposed, and a series of key technologies, such as chip manufacturing and device packaging, were developed. He received the Second Prize for China’s Technology Invention and the Second Prize for Scientific and Technological Progress.
Prof. Dr. Lijun Wang received a B.S. degree in Semiconductor Devices and an M.S. degree in Semiconductor Physics and Device Physics from Jilin University, Changchun, China, in 1973 and 1982, respectively. From 1986 to 1999, he worked with the Changchun Institute of Physics, Chinese Academy of Sciences. He has been working with the Changchun Institute of Optics, Mechanics, and Physics (CIOMP), Chinese Academy of Sciences, since 1999. He was elected an Academician of the Chinese Academy of Sciences, in 2013. He has long been engaged in basic and applied research in laser technology and other fields. He led his research team to break through the old framework of their predecessors and theoretically clarify the feasibility of the operation of a watt-level high-power vertical-cavity surface-emitting laser. New structures and design concepts, such as multi-gain regions, were proposed, and a series of key technologies, such as chip manufacturing and device packaging, were developed. He received the Second Prize for China’s Technology Invention and the Second Prize for Scientific and Technological Progress.