Pt/Ir electrodes have been extensively used in neurophysiology research in recent years as they provide more inert recording surface as compared to tungsten or stainless steel. While floating microelectrode arrays consisting of Pt/Ir electrodes are an option for neuroprosthetic applications, long-term in vivo functional performance characterization of these FMAs is lacking. In this study, we have performed comprehensive abiotic-biotic characterization of Pt/Ir arrays in twelve rats with implant periods ranging from one week up to six months. Each of the FMAs consisted of 16-channel, 1.5mm long, and 75µm diameter microwires with tapered tips that were implanted into the somatosensory cortex. Abiotic characterization included (1) pre-implant and post-explant scanning electron microscopy to study recording site changes, insulation delamination and cracking, and (2) chronic in vivo electrode impedance spectroscopy. Biotic characterization included study of microglial responses using a panel of antibodies, such as Iba1, ED1, and anti-ferritin, the latter being indicative of blood-brain barrier disruption. Significant structural variation was observed pre-implantation among the arrays in the form of irregular insulation, cracks in insulation/recording surface, and insulation delamination. We observed delamination and cracking of insulation in almost all electrodes post-implantation. These changes altered the electrochemical surface area of the electrodes and resulted in declining impedance over the long-term due to formation of electrical leakage pathways. In general, the decline in impedance corresponded with poor electrode functional performance, which was quantified via electrode yield. Our abiotic results suggest that manufacturing variability and insulation material as an important factor contributing to electrode failure. Biotic results show that electrode performance was not correlated with microglial activation (neuroinflammation) as we were able to observe poor p
3D printing using conventional stereolithography is challenging because the polymerized layers adhere to the solid constraining interface. The mechanical separation forces lead to poor process reliability and limit the geometrical design space of the printed parts. Here, these challenges are overcome by utilizing a static inert immiscible liquid below the resin as the constraining interface. We elucidate the mechanisms that enable the static liquid to mitigate stiction in both discrete layer-by-layer and continuous layerless growth modes. The inert liquid functions as a dewetting interface during the discrete growth and as a carrier of oxygen to inhibit polymerization during the continuous growth. This method enables a wide range of process conditions, such as exposure and resin properties, which facilitates micrometer scale resolutions and dimensional accuracies above 95%. We demonstrate multi-scale microstructures with feature sizes ranging from 16 μm to thousands of micrometers and functional devices with aspect ratios greater than 50:1 without using sacrificial supports. This process can enable additive 3D microfabrication of functional devices for a variety of applications.
Using a tiered deposition approach, Hf1-xZrxO2 (HZO) films with varying atomic layer deposition (ALD) cycles from 36 to 52 cycles were grown on Ge, Ir, and TiN substrates in single runs and annealed at 500 °C. 40 ALD cycle films grown on Ir exhibit a switched polarization (Psw) of 13 μC/cm2, while those grown on Ge and TiN did not exhibit measurable Psw values until 44 and 52 ALD cycles, respectively. High-resolution cross-sectional transmission electron microscopy confirmed these results; the ferroelectric films are crystalline with defined lattice fringes, while non-ferroelectric films remain amorphous. 52 ALD cycle 1:1 HZO grown on Ge had the highest Psw of all the films fabricated at 39 μC/cm2, while the 1:1 HZO grown on TiN displayed continuous wake-up and no fatigue up to 1010 cycles with the Psw increasing from <1 μC/cm2 to 21 μC/cm2.
A low-cost, manufacturable, thermally actuated, plastic microfluidic valve has been developed. The valve contains an encapsulated, temperature-sensitive fluid, which expands, deflecting a thin elastomeric film into a fluidic channel to control fluid flow. The power input for thermal expansion of each microfluidic valve can be controlled using a printed circuit board (PCB)-based controller, which is suitable for mass production and large-scale integration. A plastic microfluidic device with such valves was fabricated using compression molding and thermal lamination. The operation of the valves was investigated by measuring a change in the microchannel's ionic conduction current mediated by the resistance variation corresponding to the deflection of the microvalve. Valve closing was also confirmed by the disappearance of fluorescence when a fluorescent solution was displaced in the valve region. Valve operation was characterized for heater power ranging from 36 mW to 80 mW. When the valve was actuating, the local channel temperature was 10 to 19 °C above the ambient temperature depending on the heater power used. Repetitive valve operations (up to 50 times) have been demonstrated with a flow resulting from a hydrostatic head. Valve operation was tested for a flow rate of 0.33–4.7 µL/min.