PTB has developed a new contact based method for the traceable calibration of the normal stiffness of AFM cantilevers in the range from 0.03 N m ⁻¹ to 300 N m ⁻¹ to the SI units based on micro-electro-mechanical system (MEMS) actuators. This method is evaluated by comparing the measured cantilever stiffness with that measured by PTB’s new primary nanonewton force facility and by PTB’s microforce measuring device. The MEMS system was used to calibrate the stiffness of cantilevers in two case studies. One set of cantilevers for applications in biophysics was calibrated using the well-known thermal vibration method and the second set of cantilevers was calibrated by a cantilever manufacturer who applied an improved thermal vibration method based on calibrated reference cantilevers for the cantilever stiffness calibration. The comparison revealed a stiffness deviation of +7.7% for the cantilevers calibrated using the thermal vibration method and a deviation of +6.9% for the stiffnesses of the cantilevers calibrated using the improved thermal vibration method.

During the past decade, piezo-resistive cantilever type silicon microprobes for high-speed roughness measurements inside high-aspect-ratio microstructures, like injection nozzles or critical gas nozzles have been developed. This article summarizes their metrological properties for fast roughness and shape measurements including noise, damping, tip form, tip wear, and probing forces and presents the first results on the measurement of mechanical surface parameters. Due to the small mass of the cantilever microprobes, roughness measurements at very high traverse speeds up to 15 mm/s are possible. At these high scanning speeds, considerable wear of the integrated silicon tips was observed in the past. In this paper, a new tip-testing artefact with rectangular grooves of different width was used to measure this wear and to measure the tip shape, which is needed for morphological filtering of the measured profiles and, thus, for accurate form measurements. To reduce tip wear, the integrated silicon tips were replaced by low-wear spherical diamond tips of a 2 µm radius. Currently, a compact microprobe device with an integrated feed-unit is being developed for high-speed roughness measurements on manufacturing machines. First measurements on sinusoidal artefacts were carried out successfully. Moreover, the first measurements of the elastic modulus of a polymer surface applying the contact resonance measurement principle are presented, which indicates the high potential of these microprobes for simultaneous high-speed roughness and mechanical parameter measurements.

Long slender piezoresistive silicon microprobes are a new type of sensor for measurement of surface roughness. Their advantage is the ability to measure at speeds of up to 15 mm/s, which is much faster than conventional stylus probes. The drawbacks are their small measurement range and tendency to break easily when deflected by more than the allowed range of 1 mm. In this article, previously developed microprobes were tested in the laboratory to evaluate their metrological properties, then tested under industrial conditions. There are several industrial measurement applications in which microprobes are useful. Measurement of the roughness of paper machine rolls was selected for testing in this study. The integration of a microprobe into an existing roll measurement device is presented together with the measurement results. The results are promising, indicating that measurements using a microprobe can give useful data on the grinding process.

In this work, we present the area-selective growth of zinc oxide nanowire (NW) arrays on patterned surfaces of a silicon (Si) substrate for a piezoelectric nanogenerator (PENG). ZnO NW arrays were selectively grown on patterned surfaces of a Si substrate using a devised microelectromechanical system (MEMS)-compatible chemical bath deposition (CBD) method. The fabricated devices measured a maximum peak output voltage of ~7.9 mV when a mass of 91.5 g was repeatedly manually placed on them. Finite element modeling (FEM) of a single NW using COMSOL Multiphysics at an applied axial force of 0.9 nN, which corresponded to the experimental condition, resulted in a voltage potential of −6.5 mV. The process repeated with the same pattern design using a layer of SU-8 polymer on the NWs yielded a much higher maximum peak output voltage of ~21.6 mV and a corresponding peak power density of 0.22 µW/cm³, independent of the size of the NW array. The mean values of the measured output voltage and FEM showed good agreement and a nearly linear dependence on the applied force on a 3 × 3 µm² NW array area in the range of 20 to 90 nN.