Wei-Chun Chen

Dr. Wei-Chun Chen

Taiwan Instrument Research Institute, National Applied Research Laboratories, Hsinchu Taiwan
+1
orcid

Research Focus & Metrics

Academic Career Length

14Years (2013-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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3 October 2014 in Discover Nano
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Wei-Chun ChenWei-Chun Chen
Wei-Chun Chen
CPChun-Yen Peng
Chun-Yen Peng
LCLi Chang
Li Chang
TiN thin films were deposited on MgO (100) substrates at different substrate temperatures using rf sputtering with Ar/N2 ratio of about 10. At 700°C, the growth rate of TiN was approximately 0.05 μm/h. The structural and electrical properties of TiN thin films were characterized with x-ray diffraction (XRD), atomic force microscopy (AFM), scanning electron microscopy (SEM), transmission electron microscopy (TEM), and Hall measurements. For all deposition conditions, XRD results show that the TiN films can be in an epitaxy with MgO with cube-on-cube orientation relationship of (001)TiN // (001)MgO and [100]TiN // [100]MgO. TEM with selected-area electron diffraction pattern verifies the epitaxial growth of the TiN films on MgO. SEM and AFM show that the surface of the TiN film is very smooth with roughness approximately 0.26 nm. The minimum resistivity of the films can be as low as 45 μΩ cm.

1 January 2015 in Journal of Nanomaterials
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WWWei-Lin Wang
Wei-Lin Wang
CWChia-Ti Wang
Chia-Ti Wang
Wei-Chun ChenWei-Chun Chen
Wei-Chun Chen
KPKuo-Tzu Peng
Kuo-Tzu Peng
MYMing-Hsin Yeh
Ming-Hsin Yeh
TYTzung-Hua Ying
Tzung-Hua Ying
Ta/TaN bilayers have been deposited by a commercial self‐ionized plasma (SIP) system. The microstructures of Ta/TaN bilayers have been systematically characterized by X‐ray diffraction patterns and cross‐sectional transmission electron microscopy. TaN films deposited by SIP system are amorphous. The crystalline behavior of Ta film can be controlled by the N concentration of underlying TaN film. On amorphous TaN film with low N concentration, overdeposited Ta film is the mixture ofα‐ andβ‐phases with amorphous‐like structure. Increasing the N concentration of amorphous TaN underlayer successfully leads upper Ta film to form pureα‐phase. For the practical application, the electrical property and reliability of Cu interconnection structure have been investigated by utilizing various types of Ta/TaN diffusion barrier. The diffusion barrier fabricated by the combination of crystallizedα‐Ta and TaN with high N concentration efficiently reduces the KRc and improves the EM resistance of Cu interconnection structure.

5 July 2020 in Coatings
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YFYu-Siang Fang
Yu-Siang Fang
TDThi Hien Do
Thi Hien Do
KCKun-An Chiu
Kun-An Chiu
Wei-Chun ChenWei-Chun Chen
Wei-Chun Chen
LCLi Chang
Li Chang
Epitaxial (100) TiC film deposition on Si (100) substrate by direct current magnetron reactive sputtering of a metallic Ti target with 3%–6% CH4 in Ar gas was investigated. X-ray diffraction and cross-sectional scanning transmission electron microscopy (STEM) reveal that epitaxial cubic TiC can be grown on the Si substrate by domain matching epitaxy in 5/4 ratio with the epitaxial relationship of TiC (100)[0 1 ¯ 1] // Si (100)[0 1 ¯ 1]. For sputtering with 3% and 4% CH4, the deposited films are found to consist of both TiC and metallic Ti phases. Increasing the CH4 flow ratio to 5% results in a deposited film completely consisting of TiC without metallic Ti phase. The crystallinity of the deposited TiC is also improved with increasing the CH4 ratio to 5%. X-ray photoelectron spectroscopy shows that the [C]/[Ti] atomic ratio in TiC is nearly close to 1 for growth with 5% CH4 flow ratio and above. The measured electrical resistivities of the deposited films also increase from 41 to 153 μΩ·cm with increasing the CH4 ratio from 3% to 6%. With film growth beyond 50 nm thickness, it is shown that some disoriented TiC grains are formed.

7 November 2017 in ACS Applied Materials & Interfaces
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Journal Article
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Fang I. LaiFang I. Lai
Fang I. Lai
Jui-Fu YangJui-Fu Yang
Jui-Fu Yang
Wei-Chun ChenWei-Chun Chen
Wei-Chun Chen
Shou-Yi KuoShou-Yi Kuo
Shou-Yi Kuo

17 May 2013 in ECS Journal of Solid State Science and Technology
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Journal Article
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Wei-Chun ChenWei-Chun Chen
Wei-Chun Chen
JTJrsheng Tian
Jrsheng Tian
YWYue-Han Wu
Yue-Han Wu
WWWei-Lin Wang
Wei-Lin Wang
Shou-Yi KuoShou-Yi Kuo
Shou-Yi Kuo
LCLi Chang
Li Chang

30 August 2023 in Catalysts
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Fang I. LaiFang I. Lai
Fang I. Lai
Jui-Fu YangJui-Fu Yang
Jui-Fu Yang
Wei-Chun ChenWei-Chun Chen
Wei-Chun Chen
YHYu-Chao Hsu
Yu-Chao Hsu
Shou-Yi KuoShou-Yi Kuo
Shou-Yi Kuo
In this study, we employed a chemical solution method to grow zinc oxide (ZnO) nanorods on SnO2:F (FTO) substrates as photoelectrodes for dye-sensitized solar cells (DSSCs). The influence of varying ZnO nanorod dimensions on cell performance was investigated. Specifically, we explored the effects of nanorod length and diameter on dye adsorption capacity and photovoltaic conversion efficiency. Characterization techniques such as electrochemical impedance spectroscopy (EIS), X-ray diffraction (XRD), and field-emission scanning electron microscopy (FE-SEM) were utilized to analyze the ZnO nanorods. Our results demonstrate that the sequential growth technique allows for control over the length and diameter of ZnO nanorods, thereby modulating their optoelectronic properties. XRD and FE-SEM analyses revealed that the surface morphology of the ZnO nanorods impacts dye adsorption capacity and photovoltaic conversion efficiency. EIS measurements further indicated a significant influence of dye adsorption on the electron lifetime of ZnO nanorods. Overall, this study highlights the potential of multi-step growth of ZnO nanorods to optimize the performance of dye-sensitized solar cells by tuning their morphology and surface properties.