Mark Poliks

Prof. Mark Poliks

orcid

Research Focus & Metrics

Academic Career Length

21Years (2006-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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24 October 2019 in IEEE Transactions on Instrumentation and Measurement
Verified
Journal Article
Closed access
YGYang Gao
Yang Gao
VSVarun V. Soman
Varun V. Soman
JLJack P. Lombardi
Jack P. Lombardi
PRPravakar Prasad Rajbhandari
Pravakar Prasad Rajbhandari
TDTara P Dhakal
Tara P Dhakal
ZJZhanpeng Jin
Zhanpeng Jin
Noninvasive sensors capable of measuring weak biopotential signals, such as electrocardiogram (ECG) and EEG, and communicating results wirelessly to a host computer are developing rapidly. Some of them utilize capacitively coupled electrodes in an attempt to place the sensor at a distance from the skin. This article demonstrated the fabrication and development of a capacitively coupled ECG electrode prototype using custom high specific capacitance electrodes and custom high-performance electronics. Two ultrathin capacitive electrodes were fabricated on a flexible polyimide substrate (2 × 2 in) protected by a guard ring to reduce noise. The detection and amplification circuitry consisted of operational amplifiers (OpAmps) that filtered and conditioned the ECG signal. R-peaks in the ECG were readily detected and quantified using both simulated signals from ECG databases and real signals from human subjects. Heart rates and heart rate variability calculated from our monitor measurements were comparable with commercial rigid wearable sensors, including a smartwatch and an ECG monitor that uses standard clinical ionic electrodes. The prototype monitor was tested on human subjects during rest and moderate exercise and showed appropriate responses. The challenge of high-gain low-noise amplification was met by the development of highly thinned OpAmps whose operation was shown to be equivalent to commercially available rigidly packaged OpAmps, demonstrating that high-performance Si-electronics can be used to produce high-fidelity signals from weak biopotentials.

26 February 2021 in Journal of Micro and Nano-Manufacturing
Verified
Journal Article
Closed access
PDF file
Roozbeh Ross SalaryRoozbeh Ross Salary
Roozbeh Ross Salary
JLJack P. Lombardi
Jack P. Lombardi
DWDarshana L. Weerawarne
Darshana L. Weerawarne
Prahalada RaoPrahalada Rao
Prahalada Rao
MPMark Poliks
Mark Poliks
Aerosol jet printing (AJP) is a direct-write additive manufacturing technique, which has emerged as a high-resolution method for the fabrication of a broad spectrum of electronic devices. Despite the advantages and critical applications of AJP in the printed-electronics industry, AJP process is intrinsically unstable, complex, and prone to unexpected gradual drifts, which adversely affect the morphology and consequently the functional performance of a printed electronic device. Therefore, in situ process monitoring and control in AJP is an inevitable need. In this respect, in addition to experimental characterization of the AJP process, physical models would be required to explain the underlying aerodynamic phenomena in AJP. The goal of this research work is to establish a physics-based computational platform for prediction of aerosol flow regimes and ultimately, physics-driven control of the AJP process. In pursuit of this goal, the objective is to forward a three-dimensional (3D) compressible, turbulent, multiphase computational fluid dynamics (CFD) model to investigate the aerodynamics behind: (i) aerosol generation, (ii) aerosol transport, and (iii) aerosol deposition on a moving free surface in the AJP process. The complex geometries of the deposition head as well as the pneumatic atomizer were modeled in the ansys-fluent environment, based on patented designs in addition to accurate measurements, obtained from 3D X-ray micro-computed tomography (μ-CT) imaging. The entire volume of the constructed geometries was subsequently meshed using a mixture of smooth and soft quadrilateral elements, with consideration of layers of inflation to obtain an accurate solution near the walls. A combined approach, based on the density-based and pressure-based Navier–Stokes formation, was adopted to obtain steady-state solutions and to bring the conservation imbalances below a specified linearization tolerance (i.e., 10−6). Turbulence was modeled using the realizable k-ε viscous model with scalable wall functions. A coupled two-phase flow model was, in addition, set up to track a large number of injected particles. The boundary conditions of the CFD model were defined based on experimental sensor data, recorded from the AJP control system. The accuracy of the model was validated using a factorial experiment, composed of AJ-deposition of a silver nanoparticle ink on a polyimide substrate. The outcomes of this study pave the way for the implementation of physics-driven in situ monitoring and control of AJP.

24 August 2017 in Journal of Manufacturing Science and Engineering
Verified
Journal Article
Closed access
PDF file
Roozbeh Ross SalaryRoozbeh Ross Salary
Roozbeh Ross Salary
JLJack P. Lombardi
Jack P. Lombardi
Prahalada RaoPrahalada Rao
Prahalada Rao
MPMark Poliks
Mark Poliks
The goal of this research is online monitoring of functional electrical properties, e.g., resistance, of electronic devices made using aerosol jet printing (AJP) additive manufacturing (AM) process. In pursuit of this goal, the objective is to recover the cross-sectional profile of AJP-deposited electronic traces (called lines) through shape-from-shading (SfS) analysis of their online images. The aim is to use the SfS-derived cross-sectional profiles to predict the electrical resistance of the lines. An accurate characterization of the cross section is essential for monitoring the device resistance and other functional properties. For instance, as per Ohm’s law, the electrical resistance of a conductor is inversely proportional to its cross-sectional area (CSA). The central hypothesis is that the electrical resistance of an AJP-deposited line estimated online and in situ from its SfS-derived cross-sectional area is within 20% of its offline measurement. To test this hypothesis, silver nanoparticle lines were deposited using an Optomec AJ-300 printer at varying sheath gas flow rate (ShGFR) conditions. The four-point probes method, known as Kelvin sensing, was used to measure the resistance of the printed structures offline. Images of the lines were acquired online using a charge-coupled device (CCD) camera mounted coaxial to the deposition nozzle of the printer. To recover the cross-sectional profiles from the online images, three different SfS techniques were tested: Horn’s method, Pentland’s method, and Shah’s method. Optical profilometry was used to validate the SfS cross section estimates. Shah’s method was found to have the highest fidelity among the three SfS approaches tested. Line resistance was predicted as a function of ShGFR based on the SfS-estimates of line cross section using Shah’s method. The online SfS-derived line resistance was found to be within 20% of offline resistance measurements done using the Kelvin sensing technique.

31 May 2019 in IEEE Transactions on Components, Packaging and Manufacturing Technology
Verified
Journal Article
Closed access
VSVarun V. Soman
Varun V. Soman
DHDonggeon Han
Donggeon Han
AAAna Claudia Arias
Ana Claudia Arias
KGKanad Ghose
Kanad Ghose
MPMark Poliks
Mark Poliks
NYNatasha A. D. Yamamoto
Natasha A. D. Yamamoto
Flexible hybrid electronics (FHE) interface rigid electronic components with flexible sensors, circuits, and substrates. This paper reports the reliability improvement of a FHE Human Performance Monitor (HPM), designed to monitor electrocardiography (ECG) signals. The 50.8 mm × 50.8 mm HPM is fabricated on Kapton® HN polyimide (PI) substrate with flexible gold (Au) ECG electrodes on one side of the substrate and rigid electronic components for signal processing and communication mounted on the other side of the substrate. Our previously reported HPMs demonstrated reliability issues due to (1) cracking of the copper (Cu) circuitry, and (2) thinning and lack of adhesion at the printed Au and plated Cu interface that connected printed sensors to the Cu circuitry. Both failure mechanisms resulted in electrical opens in the circuit, which caused device failure. We explored effect of different design parameters, such as PI substrate thickness (50 μm vs 125 μm), Cu circuit thickness (2 μm vs 6 μm), solder reflow temperature (205 °C for Tin-Lead (Sn-Pb) vs 175 ° for Tin-Bismuth (Sn-Bi) solder), solder pad design, and optimized inkjet printing (printing on bare Cu vs Au plated Cu) on improving FHE reliability. Test vehicles (TVs) with different combinations of these factors were fabricated and bend tested to determine the most robust configuration. TVs with 50 μm thick PI substrate, 6 μm thick Cu circuit, Sn-Bi solder, redesigned solder pads with rounded corners, and printed Au traces on Au plated Cu pads demonstrated the best reliability results.

29 June 2020 in Advanced Engineering Materials
Verified
Journal Article
Closed access
PDF file
MAMohammed Alhendi
Mohammed Alhendi
RSRajesh S. Sivasubramony
Rajesh S. Sivasubramony
DWDarshana L. Weerawarne
Darshana L. Weerawarne
JIJoseph Iannotti
Joseph Iannotti
PBPeter Borgesen
Peter Borgesen
MPMark Poliks
Mark Poliks

28 May 2019 in Journal of Manufacturing Science and Engineering
Verified
Journal Article
Closed access
PDF file
JLJack P. Lombardi
Jack P. Lombardi
Roozbeh Ross SalaryRoozbeh Ross Salary
Roozbeh Ross Salary
DWDarshana L. Weerawarne
Darshana L. Weerawarne
Prahalada RaoPrahalada Rao
Prahalada Rao
MPMark Poliks
Mark Poliks
Aerosol jet printing (AJP) is a complex process for additive electronics that is often unstable. To overcome this instability, observation while printing and control of the printing process using image-based monitoring is demonstrated. This monitoring is validated against images taken after the print and shown highly correlated and useful for the determination of printed linewidth. These images and the observed linewidth are used as input for closed-loop control of the printing process, with print speed changed in response to changes in the observed linewidth. Regression is used to relate these quantities and forms the basis of proportional and proportional integral control. Electrical test structures were printed with controlled and uncontrolled printing, and it was found that the control influenced their linewidth and electrical properties, giving improved uniformity in both size and electrical performance.