Huang Wengang

Dr. Huang Wengang


Research Focus & Metrics

Academic Career Length

10Years (2017-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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20 September 2018 in Micromachines
Verified
Journal Article
Open access
PDF file
HLHaitao Liu
Haitao Liu
KWKai Wei
Kai Wei
ZLZhengzhou Li
Zhengzhou Li
HWHuang Wengang
Huang Wengang
XYXU Yi
XU Yi
WCWei Cui
Wei Cui
In this paper, a novel, hybrid-integrated, high-precision, vacuum microelectronic accelerometer is put forward, based on the theory of field emission; the accelerometer consists of a sensitive structure and an ASIC interface (application-specific integrated circuit). The sensitive structure has a cathode cone tip array, a folded beam, an emitter electrode, and a feedback electrode. The sensor is fabricated on a double-sided polished (1 0 0) N-type silicon wafer; the tip array of the cathode is shaped by wet etching with HNA (HNO3, HF, and CH3COOH) and metalized by TiW/Au thin film. The structure of the sensor is finally released by the ICP (inductively coupled plasma) process. The ASIC interface was designed and fabricated based on the P-JFET (Positive-Junction Field Effect Transistor) high-voltage bipolar process. The accelerometer was tested through a static field rollover test, and the test results show that the hybrid-integrated vacuum microelectronic accelerometer has good performance, with a sensitivity of 3.081 V/g, the non-linearity is 0.84% in the measuring range of −1 g~1 g, the average noise spectrum density value is 36.7 μV/ Hz in the frequency range of 0–200 Hz, the resolution of the vacuum microelectronic accelerometer can reach 1.1 × 10−5 g, and the zero stability reaches 0.18 mg in 24 h.

23 May 2017 in Preprints.org
Verified
Preprint
Open access
PDF file
HLHaitao Liu
Haitao Liu
ZWZhiyu Wen
Zhiyu Wen
HWHuang Wengang
Huang Wengang
DLDongling Li
Dongling Li
LCLi Chen
Li Chen
XYXiaoHan Yuan
XiaoHan Yuan
In this paper, a novel integrated high precision vacuum microelectronic accelerometer is put forward based on the theory of field emission, the accelerometer consists of sensitive structure and interface ASIC. The sensitive structure has a mass of a cathode cone tips array, a folded beam, an emitter electrode and a feedback electrode. The sensor is fabricated on a double side polished (1 0 0) N-type silicon wafer, the tips array of cathode are shaped by wet etching with HNA (HNO3, HF and CH3COOH) and metalized by TiW/Au thin film. The structure of sensor is released by ICP process finally. The interface ASIC was designed and fabricated based on the P-JFET high voltage bipolar process. The accelerometer is tested through static field rollover test, and the test results show the integrated vacuum microelectronic accelerometer has good performances, which sensitivity is 3.081V/g and non-linearity is 0.84% in the measuring range of −1g~1g.