The explosive demand for high-performance secondary power sources in artificial intelligence (AI) has brought significant opportunities for low-voltage GaN devices. This paper focuses on research on high-efficiency and high-reliability low-voltage p-GaN gate HEMTs with a gate–drain distance, L_GD, of 1 to 3 μm in our pilot line, manufactured on 6-inch Si using a CMOS-compatible process, with extraordinary wafer-level uniformity. Specifically, these fabricated p-GaN gate HEMTs with an L_GD of 1.5 μm demonstrate a blocking voltage of over 180 V and a high V_TH of 1.6 V and exhibit a low R_ON of 2.8 Ω·mm. It is found that device structure optimization can significantly enhance device reliability. That is, through the dedicated optimization of source field plate structure and interlayer dielectric (ILD) thickness, the dynamic ON-resistance, R_ON, degradation of devices with an L_GD of 1.5 µm was successfully suppressed from 60% to 20%, and the V_TH shift was significantly reduced from 1.1 to 0.5 V. Further, the devices also passed preliminary gate bias stress and high-voltage OFF-state stress tests, providing guidance for preparing high-performance, low-voltage p-GaN gate HEMTs in the future.

The application of GaN HEMTs on silicon substrates in high-voltage environments is significantly limited due to their complex buffer layer structure and the difficulty in controlling wafer warpage. In this work, we successfully fabricated GaN power HEMTs on 6-inch sapphire substrates using a CMOS-compatible process. A 1.5 µm thin GaN buffer layer with excellent uniformity and a 20 nm in situ SiN gate dielectric ensured uniformly distributed V_TH and R_ON across the entire 6-inch wafer. The fabricated devices with an L_GD of 30 µm and W_G of 36 mm exhibited an R_ON of 18.06 Ω·mm and an off-state breakdown voltage of over 3 kV. The electrical mapping visualizes the high uniformity of R_ON and V_TH distributed across the whole 6-inch wafer, which is of great significance in promoting the applications of GaN power HEMTs for medium-voltage power electronics in the future.