Crystallographically anisotropic platelet iron particles were successfully prepared using a conventional ball mill with addition of graphite (Gp) particles. The morphological and structural changes resulting from the milling were investigated using scanning electron microscopy and X-ray diffraction. The spherical iron particles were plastically deformed into platelet shapes during the milling. Simultaneously, it is suggested that the size of the Gp particles decreased and adhered as nanoparticles on the surface of the iron particles. The adhered Gp particles affected the plastic deformation behavior of the iron particles: the {001} planes of α-iron were oriented parallel to the particle face, and no preferred in-plane orientation was observed. This study not only details the preparation of soft magnetic metal particles that crystallographically oriented to enhance their magnetic properties but also provides new insight into the activities of the well-established and extensively studied mechanical milling method.

Fe–Si–B–P–Cu nanocrystalline alloy were treated with ball-mill using a lubricant as a process control agent (PCA). The resulting alloy powder is a strong candidate material for soft magnetic composites. Two ball milling methods (continuous and interval) were employed to control the interactions between the PCA and the alloy surface, and their effect on the microstructure of the prepared alloy particles was investigated. The alloy sheet was broken into small pieces and deformed plastically into flake-shaped particles regardless of the ball milling method implemented. Friction-force microscopy of the alloy immersed in the PCA revealed that the friction coefficient of the alloy surface exposed to air for a certain period was higher than that of the unexposed alloy surface (immediately after polishing). During ball milling, the ratio of the newly generated surface to the oxidized surfaces of the alloy subjected to interval milling was smaller than that of the alloy subjected to continuous milling. Therefore, the friction coefficient of the surface of the alloy subjected to interval milling was higher than that of the alloy subjected to continuous milling. Synchrotron radiation analysis revealed that the alloy subjected to interval milling exhibited enhanced surface friction, showing an obvious steepness and inflection in the diffraction intensity as a function of the tilt angle based on the Schulz reflection method. This indicates formation of crystallographic texture in α-Fe grains in an amorphous matrix. Hence, we demonstrated successfully that the ball milling process induced a crystallographic texture in the Fe-based nanocrystalline alloy due to plastic deformation due to the enhanced surface friction. The surface of the alloy was prepared based on the effect of the interfacial interactions between the alloy surface and the PCA.

As electronic packaging technology advances towards miniaturization and integration, the issue of electromigration (EM) in lead-free solder joints has become a significant factor affecting solder joint reliability. In this study, a Sn-3.0Ag-0.5Cu (SAC305) alloy was used as the base, and different Bi content alloys, SAC305-xBi (x = 0, 0.5, 0.75, 1.0 wt.%), were prepared for tensile strength, hardness, and wetting tests. Copper wire was used to prepare EM test samples, which were subjected to EM tests at a current density of approximately 0.6 × 10⁴ A/cm² for varying durations. The interface microstructure of the SAC305-xBi alloys after the EM test was observed using an optical microscope. The results showed that the 0.5 wt.% Bi alloy exhibited the highest ultimate tensile strength and microhardness, improving by 33.3% and 11.8% compared to SAC305, respectively, with similar fracture strain. This alloy also displayed enhanced wettability. EM tests revealed the formation of Cu₆Sn₅ and Cu₃Sn intermetallic compounds (IMCs) at both the cathode and anode interfaces of the solder alloy. The addition of Bi inhibited the diffusion rate of Sn in Cu₆Sn₅, resulting in similar total IMC thickness at the anode interface across different Bi contents under the same test conditions. However, the total IMC thickness at the cathode interface decreased and stabilized with increasing EM time, with the SAC305-0.75Bi alloy demonstrating the best resistance to EM.