The femtosecond GHz-burst mode laser processing has attracted much attention in the last few years. Very recently, the first percussion drilling results obtained in glasses using this new regime were reported. In this study, we present our latest results on top-down drilling in glasses, focusing specifically on the influence of burst duration and shape on the hole drilling rate and the quality of the drilled holes, wherein holes of very high quality with a smooth and glossy inner surface can be obtained. We show that a decreasing energy repartition of the pulses within the burst can increase the drilling rate, but the holes saturate at lower depths and present lower quality than holes drilled with an increasing or flat energy distribution. Moreover, we give an insight into the phenomena that may occur during drilling as a function of the burst shape.

In this contribution, we present novel results on top-down drilling in silicon, the most important semiconductor material, focusing specifically on the influence of the laser parameters. We compare the holes obtained with repetitive single pulses, as well as in different MHz- and GHz-burst regimes. The deepest holes were obtained in GHz-burst mode, where we achieved holes of almost 1 mm depth and 35 µm diameter, which corresponds to an aspect ratio of 27, which is higher than the ones reported so far in the literature, to the best of our knowledge. In addition, we study the influence of the energy repartition within the burst in GHz-burst mode.

In this contribution, we present a comparative study on top-down drilling in sodalime glass, with a femtosecond laser operating in single-pulse, MHz-burst and GHz-burst modes, respectively. We investigate the hole depth, drilling rate, and hole morphology for these three regimes while keeping the same experimental conditions. We demonstrate that, for both burst regimes, the burst length has to be adapted for optimizing the hole depth. In the GHz-burst regime, the lower the ablation rate the longer the holes. The three drilling regimes lead to different hole morphologies, where the GHz-burst mode results in the best hole quality featuring glossy inner walls and an almost cylindrical morphology. Furthermore, we obtain crack-free holes, the deepest measuring 3.7 mm in length and 25 µm in entrance diameter corresponding to an aspect ratio of 150, which is the highest aspect ratio reported thus far with femtosecond GHz-burst drilling to the best of our knowledge.

We report, for the first time to the best of our knowledge, Bessel beam dielectrics cutting with a femtosecond laser in GHz-burst mode. The non-diffractive beam shaping is based on the use of an axicon and allows for cutting glasses up to 1 mm thickness with an excellent cutting quality. Moreover, we present a comparison of the cutting results with the state-of-the-art method, consisting of short MHz-bursts of femtosecond pulses. We further illustrate the influence of the laser beam parameters such as the burst energy and the pitch between consecutive Bessel beams on the machining quality of the cutting plane and provide process windows for both regimes.

We investigate the elongated modifications resulting from a Bessel beam-shaped femtosecond laser in fused silica under three different operation modes, i.e., the single-pulse, MHz-burst, and GHz-burst regimes. The single-pulse and MHz-burst regimes show rather similar behavior in glass, featuring elongated and slightly tapered modifications. Subsequent etching with Potassium Hydroxide exhibits an etching rate and selectivity of up to 606 $\mathsf{\mu }$m/h and 2103:1 in single-pulse operation and up to 322 $\mathsf{\mu }$m/h and 2230:1 in the MHz-burst regime, respectively. Interestingly, in the GHz-burst mode, modification by a single burst of 50 pulses forms a taper-free hole without any etching. This constitutes a significant result paving the way for chemical-free, on-the-fly drilling of high aspect-ratio holes in glass.

Ultrafast laser technology presents the unique capacity to process glass materials with an outstanding processing quality; however, combining high quality and high throughput is still a crucial issue because glass is brittle and highly heat sensitive. One strategy to overcome this limitation is to split in space the main laser beam into multiple beams for process parallelization. In the present paper, the simultaneous interaction of several femtosecond laser beams at the surface of fused silica targets is addressed experimentally and theoretically. This work is devoted to highlight the beams cooperation for inducing stress in the material. The experiment consists in irradiating the target with multiple laser pulses with a wavelength of 1030 nm and a duration of 500 fs. The induced stress is observed through post-mortem cross-polarized microscopy. A multiscale and multiphysics model describing laser energy deposition into the material and its mechanical response is developed. The influence of various laser parameters is studied: number and position of laser beams, repetition rate, and fluence. Both experimental and modeling results, which are in a good agreement, show significant cooperative effects for stress formation with large enough laser energy deposition, possibly leading to detrimental cracks.