Superhydrophobic surfaces have attracted broad attention because of their unique water repellency but are restricted by poor wear resistance, weak adhesion to the substrate, and complex fabrication processes. Herein, a double-layer coating strategy consisting of the amino fluorine–silicone resin/epoxy resin (AFSR/EP) system is created. The system features a high hardness and transparent hydrophobic interface adhesive layer through the amine–epoxy “click” chemical reaction. The environmentally friendly resin system and low-cost nano-silica particles (n-SiO₂) are composited and sprayed onto the substrate surface to form a superhydrophobic layer with outstanding robustness and excellent environmental stability. The prepared AFSR/EP@n-SiO₂ composite coatings have a water contact angle of 161.1° and a sliding angle of 3.4°, demonstrating high superhydrophobic properties. Benefitting from the complementary advantages of silicone/epoxy resin, the prepared composite coatings maintain remarkable water repellency after various harsh environmental tests, including cyclic mechanical abrasion and tape-stripping, acid–base (pH 1 and pH 14) treatment, 10 wt% NaCl (pH 7) salt solution immersion, temperature treatment, knife scratching, and long-term ultraviolet radiation treatment, showing reinforced mechanical robustness and durable anti-corrosion stability. Notably, surface hardness of 5H and optical transparency over 80% can be achieved. The simple method offers a novel approach for the large-scale preparation of multifunctional superhydrophobic coatings.

As one of the most widely used packaging materials, epoxy composite (EP) offers excellent insulation properties; however, its intrinsic low thermal conductivity (TC) limits its application in high-frequency and high-power devices. To enhance the TC of EP, six highly thermally conductive inorganic fillers, namely, Al₂O₃, MgO, ZnO, Si₃N₄, h-BN, and AlN, were incorporated into the EP matrix at varying contents (60–90 wt.%). The resulting epoxy molding compounds (EMCs) demonstrated significant improvement in thermal conductivity coefficient (λ) at high filler contents (90 wt.%), ranging from 0.67 W m⁻¹ K⁻¹ to 1.19 W m⁻¹ K⁻¹, compared to the pristine epoxy composite preform (ECP, 0.36 W m⁻¹ K⁻¹). However, it was found that the interfacial thermal resistance (ITR) between EP and filler materials is a major hindrance restricting TC improvement. In order to address this challenge, graphene nanosheets (GNSs) and carbon nanotubes (CNTs) were introduced as additives to reduce the ITR. The experimental results indicated that CNTs were effective in enhancing the TC, with the optimized EMC achieving a λ value of 1.14 W m⁻¹ K⁻¹ using 60 wt.% Si₃N₄ + 2 wt.% CNTs. Through the introduction of a small amount of CNT (2 wt.%), the inorganic filler content was significantly reduced from 90 wt.% to 60 wt.% while still maintaining high thermal conductivity (1.14 W m⁻¹ K⁻¹). We propose that the addition of CNTs helps in the construction of a partial heat conduction network within the EP matrix, thereby facilitating interfacial heat transfer.

In the field of flexible electronics manufacturing, inkjet printing technology is a research hotspot, and it is key to developing low-temperature curing conductive inks that meet printing requirements and have suitable functions. Herein, methylphenylamino silicon oil (N75) and epoxy-modified silicon oil (SE35) were successfully synthesized through functional silicon monomers, and they were used to prepare silicone resin 1030H with nano SiO₂. 1030H silicone resin was used as the resin binder for silver conductive ink. The silver conductive ink we prepared with 1030H has good dispersion performance with a particle size of 50–100 nm, as well as good storage stability and excellent adhesion. Additionally, the printing performance and conductivity of the silver conductive ink prepared with n,n-dimethylformamide (DMF): proprylene glycol monomethyl ether (PM) (1:1) as solvent are better than those of the silver conductive ink prepared by DMF and PM solvent. Cured at a low temperature of 160 °C, the resistivity of 1030H-Ag-82%-3 conductive ink is 6.87 × 10⁻⁶ Ω·m, and that of 1030H-Ag-92%-3 conductive ink is 0.564 × 10⁻⁶ Ω·m, so the low-temperature curing silver conductive ink has high conductivity. The low-temperature curing silver conductive ink we prepared meets the printing requirements and has potential for practical applications.