3D-printing technology is opening up new possibilities for the co-printing of sensory elements. While quasi-static research has shown promise, the dynamic performance has yet to be researched. This study researched smart 3D structures with embedded and printed sensory elements. The embedded strain sensor was based on the conductive PLA (Polylactic Acid) material. The research was focused on dynamic measurements of the strain and considered the theoretical background of the piezoresistivity of conductive PLA materials, the temperature effects, the nonlinearities, the dynamic range, the electromagnetic sensitivity and the frequency range. A quasi-static calibration used in the dynamic measurements was proposed. It was shown that the temperature effects were negligible, the sensory element was linear as long as the structure had a linear response, the dynamic range started at ∼ 30 $\mathsf{\mu }\mathsf{ϵ}$ and broadband performance was in the range of few kHz (depending on the size of the printed sensor). The promising results support future applications of smart 3D-printed systems with embedded sensory elements being used for dynamic measurements in areas where currently piezo-crystal-based sensors are used.

As a major challenge, sustainable energy management and energy self-sufficiency require microsystems that manage multiple energy operations in a single device. In this work, flexible thick-film structures with promising energy storage and electrocaloric cooling capabilities as well as piezoelectric properties are developed. The functional thick-film layer is based on relaxor-ferroelectric 0.65Pb(Mg_1/3Nb_2/3)O₃–0.35PbTiO₃ (PMN–35PT) directly deposited on a flexible polyimide substrate by an aerosol deposition method. The thick-film structures exhibit a promising recoverable energy-storage density of 10.3 J cm⁻³. After extensive bending tests, the structures showed no signs of degradation. The high bendability and durability are confirmed by stable energy storage properties after bending up to a radius of 1.5 mm (2.4% bending strain) and 10⁵ repeated bending cycles. The developed thick-film structures also exhibit a piezoelectric coefficient d₃₃ of ∼80 pm V⁻¹. Using two direct electrocaloric measurement methods, we demonstrated that the electrocaloric temperature change in the prepared PMN–35PT thick-film structures reaches a maximum of 0.87 K at 63.5 °C and 300 kV cm⁻¹, which exceeds the value of 0.72 K at ∼65 °C and 60 kV cm⁻¹ reported for bulk ceramics of the same composition. The PMN–35PT thick films prepared here are thick-film structures with excellent flexibility, promising for future multifunctional microsystems that manage multiple energy operations, enabling comprehensive energy harvesting, storage and conversion to thermal energy.