3D integration photonic interposer is becoming popular in the field of co-packaging optics (CPO). In this paper, we integrate the edge coupler and through silicon via (TSV) into the silicon interposer. Different high-frequency transmission lines are designed, analyzed and simulated. The measured results and the simulation have a good correspondence. The high frequency transmission lines, which consist of 10 μm × 100 μm TSVs and two redistribution layer (RDL) lines of 100 μm on the top layer and one 100 μm RDL line on the bottom layer, shows perfect insertion loss less than 0.35 dB @67 GHz. In addition, the 56GBaud (112Gbps) eye diagram is tested and shows excellent transmission quality. Edge couplers are designed and fabricated by packaging process. The coupling loss of coupler is less than 1.7 dB/facet. The 3D optical package module based on the active optical interposer has also been realized and verified.

The new generation of data centers is further evolving towards the direction of high speed and intelligence, which puts forward a great demand for the iteration of optical interconnection technology. Three-dimensional integration based on active photonic interposers can achieve the advantages of high integration, high bandwidth and low power consumption, which has become the main direction for next generation optical module technology. The fabrication and assembly of 3D optical modules based on active interposer-integrated edge couplers and TSV are realized in this paper. Different active interposer processes with integrated edge couplers and RDL-TSV-RDL structures are discussed, manufactured, analyzed and evaluated. The problem of the co-fabrication of the TSV and edge coupler was solved, and perfect electrical and optical characteristics were also achieved. Finally, the fabrication of the substrate and the assembly of the 3D optical module were completed. This paper lays a solid foundation for the further research and large-scale application of 3D optical modules in the future.

With the development of the data center, the appropriate packaging design of coherent optical module applied in data center is becoming more and more important. The coherent optical module with organic substrate could reduce the cost and increase the bandwidth. However, realizing the high-speed signal transmission on organic substrate is one of the bottlenecks in the whole transmission system of coherent module. In the transmission of high-speed signal, it is inevitable to meet the impedance discontinuities such as AC-coupled capacitors and holes. These impedance discontinuities seriously affect signal integrity. Therefore, this paper studies the compensation method for these impedance discontinuities. After the careful design and optimization, the results show that inductance compensation can effectively improve the transmission performance. The lowest insertion loss S21, is - 1.2dB, fully meeting the design requirements of 3dB, and the highest reflection loss S11, is less than -10dB. The maximum value of TDR is 101.5Ω, and the minimum value is 97 Ω.