Purpose: – The main advantages of vapour phase soldering are a non-oxygen environment, the elimination of overheating and the possibility of the vacuum application, which can guarantee undeniably higher quality of solder joints, especially as regards void formation. These features are less affected by the alloy composition. The paper aims to discuss these issues. Design/methodology/approach: – The quality of solder joints made in two VPS options (with and without vacuum) was investigated in terms of voids formation. Solder alloys of 37%Pb63%Sn (PbSn) and 96%Sn3.5%Ag0.5%Cu (SAC 305) were applied to an etched Cu layer on a glass-epoxy substrate using the screen-printing method. 1206 SMD resistors were placed on the solder pads with a Quadra pick-and place machine. For the inspection of joint structure and void identification, 3D X-ray images of samples were taken using a computed tomography system with a 180 kV/15 W nanofocus. For comparison, traditional cross-sections of the samples were performed using a metallographic polisher. The cross-section analysis was done in a scanning electron microscope (SEM). To confirm the relevance of these data, a statistical analysis was carried out. Findings: – The paper shows that alloy composition has less impact on the quality of joints as regards void formation. The tendency for a different arrangement of voids in a junction depending on the distance SMD element and the thickness of the solder layer was investigated using X-ray computed tomography. Originality/value: – The use of 3D computed tomography for void investigation gives full information about the internal structure of the joint and allows for precise void identification. Vacuum application during the soldering allows significant voids elimination.

The paper reports on the influence of processing on microstructure and electrical properties of multilayer varistors based on zinc oxide doped with Bi₂O₃, Sb₂O₃, Co₂O₃, MnO, Cr₂O₃, B₂O₃, and SiO₂. 0.5–1 wt% of AlF₃-CaB₄O₇ was used as a new effective sintering aid. The behavior of green laminates during heating was characterized using differential thermal analysis and a heating microscope. As revealed by XRD, SEM, and EDS methods, the varistor layers are composed of ZnO grains of 1–5 µm size, submicrometer spinel and pyrochlore grains situated at the ZnO grain boundaries, and nanometric Bi₂O₃-rich films surrounding ZnO grains. Complex impedance studies carried out in the frequency range of 0.01 Hz-2 MHz at temperatures changing from −30 to 150 °C imply the formation of semiconducting grains and insulating grain boundaries. Frequency dependence of dielectric permittivity shows a high plateau at lower frequencies, typical for barrier layer capacitance effect. The fabricated multilayer varistors show nonlinear current-voltage characteristics with a high nonlinear coefficient of 26–38. The breakdown voltage was found to decrease within the range of 66–130 V with sintering temperature increasing from 1000 to 1100 °C. Good surge current capability of the varistors was confirmed by the tests using 8/20 µs pulses.

The properties of Sn99Ag0.3Cu0.7 (SACX0307) solder alloy reinforced with ZnO nanoparticles were investigated. The primary ZnO particle sizes were 50, 100, and 200 nm. They were added to a solder paste at a ratio of 1.0 wt %. The wettability, the void formation, the mechanical strength, and the thermoelectric parameters of the composite solder alloys/joints were investigated. Furthermore, microstructural evaluations were performed using scanning electron and ion microscopy. ZnO nanoparticles decreased the composite solder alloys’ wettability, which yielded increased void formation. Nonetheless, the shear strength and the thermoelectric parameters of the composite solder alloy were the same as those of the SACX0307 reference. This could be explained by the refinement effects of ZnO ceramics both on the Sn grains and on the Ag₃Sn and Cu₆Sn₅ intermetallic grains. This could compensate for the adverse impact of lower wettability. After improving the wettability, using more active fluxes, ZnO composite solder alloys are promising for high-power applications.