The bionic cilium MEMS vector hydrophone has the characteristics of low power consumption, small volume, and good low-frequency response. Nevertheless, there exists the problem of left–right ambiguity in the azimuth estimation of a single hydrophone. In order to solve the engineering application problem, a sound-pressure sound-pressure-gradient hydrophone is designed in this paper. The new composite hydrophone consists of two channels. The bionic cilium microstructure is optimized and used as the vector channel, to collect the sound pressure gradient information, and a scalar channel, based on a piezoelectric ceramic tube, is added, to receive the sound pressure information. The theoretical analysis, simulation analysis, and test analysis of the composite hydrophone are carried out, respectively. The test results show that the sensitivities of the hydrophone can reach up to −188 dB (vector channel) and −204 dB (scalar channel). The problem of left–right ambiguity is solved by combining the sound pressure and sound pressure gradient in different ways. This is of great significance in the engineering application of single cilium MEMS hydrophone orientation.

We report a cost-effective and scalable methodology for producing a hierarchical micro-/nanostructured silicon surface solely by metal-assisted chemical etching. It involves two major processing steps of fabricating micropillars and nanowires separately. The process of producing micro-scale structures by masked metal-assisted chemical etching was optimized. Silicon nanowires were created on the micropillar’s surface via maskless metal-assisted chemical etching. The hierarchical micro-/nanostructured surface exhibits superhydrophobic properties with a high contact angle of ~156° and a low sliding angle of <2.5° for deionized water. Furthermore, due to the existence of microscale and nanoscale air trapped at the liquid/solid interface, it exhibits a long ice delay time of 2876 s at −5 °C, more than 5 times longer than that of smooth surfaces. Compared to conventional dry etching methods, the metal-assisted chemical etching approach excludes vacuum environments and high-temperature processes and can be applied for applications requiring hierarchical micro-/nanostructured surfaces or structures.

A new type of array MEMS (Microelectro Mechanical Systems) vector hydrophone has been proposed to solve the left-right ambiguity problem that is commonly found in current ones. Meanwhile, the advantages of good sensitivity and low fabrication cost are maintained. The array MEMS vector hydrophone is integrated by four units oriented at different direction angles. By the aid of this kind of vector hydrophone, not only the exact direction of the sound source can be measured, but also the position obtained. The working principle of the array microstructure has been analyzed and simulated. The result shows that the position of the sound source can be well determined. The prototype of the hydrophone is fabricated based on standard MEMS technology, and its performance is tested in a standing wave tube and an anechoic tank. The testing results show that the array hydrophone exhibits a good consistency of all the four units and satisfactory performance. More importantly, this array hydrophone exhibits excellent ability of positioning with the relatively small angle error. Thus, a MEMS hydrophone with multiple functions and relatively high performance is realized, which has important theoretical and practical significance in relevant applications such as the small-size underwater vehicles.

Real-time monitoring of drug delivery in an intravenous infusion system can prevent injury caused by improper drug doses. As the medicine must be administered into the vein at different rates and doses in different people, an ideal intravenous infusion system requires both a low flow rate and large dynamic range monitoring. In this study, a bio-inspired and micromachined volumetric flow sensor is presented for the biomedical application of an intravenous system. This was realized by integrating two sensing units with different sensitivities on one silicon die to achieve a large dynamic range of the volumetric flow rate. The sensor was coated with a parylene layer for waterproofing and biocompatibility purposes. A new packaging scheme incorporating a silicon die into a flow channel was employed to demonstrate the working prototype. The test results indicate that the sensor can detect a volumetric flow rate as low as 2 mL/h, and its dynamic range is from 2 mL/h to 200 mL/h. The sensor performed better than the other two commercial sensors for low-flow detection. The high sensitivity, low cost, and small size of this flow sensor make it promising for intravenous applications.

Herein, we report a helium ion-bombardment enhanced etching method for silicon nanofabrication without the use of resists; furthermore, we demonstrate its unique advantages for straightforward fabrication on irregular surfaces and prototyping nano-electro-mechanical system devices, such as self-enclosed Si nanofluidic channels and mechanical nano-resonators. This method employs focused helium ions to selectively irradiate single-crystal Si to disrupt the crystal lattice and transform it into an amorphous phase that can be etched at a rate 200 times higher than that of the non-irradiated Si. Due to the unique raindrop shape of the interaction volumes between helium ions and Si, buried Si nanofluidic channels can be constructed using only one dosing step, followed by one step of conventional chemical etching. Moreover, suspended Si nanobeams can be fabricated without an additional undercut step for release owing to the unique raindrop shape. In addition, we demonstrate nanofabrication directly on 3D micro/nano surfaces, such as an atomic force microscopic probe, which is challenging for conventional nanofabrication due to the requirement of photoresist spin coating. Finally, this approach can also be extended to assist in the etching of other materials that are difficult to etch, such as silicon carbide (SiC).

Based on the random distribution characteristic of abrasive grains for the grinding wheel circumferential surface during the manufacturing process, considering the grinding parameters and deflection parameters comprehensively, a randomly deflected truncated cone shape single abrasive grain cutting simulation model was established. Then, studying its cutting mechanism, i.e., the trajectory length value by numerical method and formula method was compared, the consequence indicates that the error is extremely small; this demonstrates the accuracy of the numerical method. The calculation and analysis of the workpiece cutting surface topography and the undeformed chip shape were carried out; it shows that the cutting surface topography and the undeformed chip shape are coincident. And the calculation results of the model were compared to verify. The influence laws of each grinding process parameter on the material removal volume (MRV) and material removal rate (MRR) were investigated; the results display that the grinding method affects the changing pattern of MRV and MRR; when the grinding method was up-grinding, a high wheel speed or a small wheel diameter is able to enhance the MRR; the MRV and MRR are increments with the increasing workpiece feed speed or abrasive grain cutting depth; and the MRV and MRR decrease with the raising of the absolute value of single abrasive grain deflection angle. The situation is a similar or opposite trend in down grinding. This work can provide a theoretical reference for the selection and optimization of parameters and further lay a foundation for the research in the grinding mechanism of the grinding wheel.