The behavior of silicon carbide (SiC) power MOSFETs under stressful short-circuit (SC) conditions is investigated in this paper. Two different SC failure phenomena for SiC power MOSFETs are thoroughly reported. Experimental evidence and TCAD electrothermal simulations are exploited to describe and discriminate the failure sources. Physical causes are finally investigated and explained by means of properly calibrated numerical investigations and are reported along with their effects on devices' SC capability.

This paper presents an efficient circuit-based approach for the nonlinear dynamic electrothermal simulation of power devices and systems subject to radical self-heating. The strategy relies on the synthesis of a nonlinear compact thermal network extracted from a finite-element model by a novel model-order reduction method requiring a computational time orders of magnitude lower than conventional techniques. Unlike commonly employed approaches, the proposed network allows reconstructing the whole time evolution of the temperature field in all the points of the domain with high accuracy. Electrothermal simulations are enabled in a commercial SPICE-like simulator by coupling such a network with subcircuits that describe the electrical device behavior by accounting for the temperature dependence of the key physical parameters. As a case study, the dynamic electrothermal analysis of a packaged silicon carbide power MOSFET undergoing a short-circuit test is performed, showcasing the performance of the approach and highlighting the need of including the thermal nonlinearities to achieve reliable results.

In this paper we present a novel approach to temperature sensing with optoelectronic devices which relies on the usage of bare silicon as the transducing material. The device is composed by a single mode input waveguide, a MMI region where a number of higher order modes is also allowed to propagate and two output waveguides. The refractive index variation in the MMI section due to temperature shifts induces different phase velocities of the various propagating modes. The position of the input and output waveguides together with the length and width of the MMI section are chosen in order to maximize the sensitivity of the device. Analytical calculations are presented together with BPM simulations aimed to the maximization of the sensitivity of the sensor as a function of its geometries.