The inductively coupled plasma reactive ion etching (ICP-RIE) is a selective dry etching method used in fabrication technology of various semiconductor devices. The etching is used to form non-planar microstructures—trenches or mesa structures, and tilted sidewalls with a controlled angle. The ICP-RIE method combining a high finishing accuracy and reproducibility is excellent for etching hard materials, such as SiC, GaN or diamond. The paper presents a review of silicon carbide etching—principles of the ICP-RIE method, the results of SiC etching and undesired phenomena of the ICP-RIE process are presented. The article includes SEM photos and experimental results obtained from different ICP-RIE processes. The influence of O₂ addition to the SF₆ plasma as well as the change of both RIE and ICP power on the etching rate of the Cr mask used in processes and on the selectivity of SiC/Cr etching are reported for the first time. SiC is an attractive semiconductor with many excellent properties, that can bring huge potential benefits thorough advances in submicron semiconductor processing technology. Recently, there has been an interest in SiC due to its potential wide application in power electronics, in particular in automotive, renewable energy and rail transport.

Arguably, SiC technology is the most rapidly expanding IC manufacturing technology driven mostly by the aggressive roadmap for battery electric vehicle penetration and also industrial high-voltage/high-power applications. This paper provides a comprehensive overview of the state of the art of SiC technology focusing on the challenges starting from the difficult and lengthy SiC substrate growth all the way to the complex MOSFET assembly processes. We focus on the differentiation from the established Si manufacturing processes and provide a comprehensive list of references as well as a brief description of our own research into the key manufacturing processes in this technology. We also present a SiC technology and product roadmap.

Laplace photoinduced transient spectroscopy has been applied to determine the electronic properties and concentrations of deep traps in high purity n-type silicon irradiated with high fluences of 23-MeV protons. From the temperature dependence of thermal emission rates of excess charge carriers obtained by the analysis of the photocurrent relaxation waveforms measured at temperatures of 30–320 K, eight deep traps with activation energies ranging from 255 to 559 meV have been resolved. The dependence of these trap’s concentrations on the proton fluence are demonstrated for the fluence values ranging from 1 × 10¹⁴ to 5 × 10¹⁵ n_eq/cm². In comparison to the previously reported results of theoretical and experimental studies on the electronic properties of small vacancy clusters in irradiated silicon, we tentatively attribute four detected traps with activation energies of 255, 367, 405, and 512 meV to the energy levels related to the 2−/− charge state changes of divacancy (V₂), trivacancy (V₃), tetravacancy (V₄), and pentavacancy (V₅), respectively. Simultaneously, we propose the attribution of four deep traps with higher activation energies of 415, 456, 526, and 559 meV to the energy levels related to the −/0 charge state changes of these small vacancy clusters, respectively.

For the first time, the Z₁ and Z₂ defects with closely spaced energy levels having negative-U properties are revealed in high-purity semi-insulating (HPSI) 4H-SiC using Laplace-transform photoinduced transient spectroscopy (LPITS). In this material, after switching off the optical trap-filling pulse, either the one-electron or the two-electron thermally stimulated emission from these defects is observed at temperatures 300–400 K. It is found that the former corresponds to the Z₁^0/+ and Z₂^0/+ transitions with the activation energies of 514 and 432 meV, respectively, and the latter is associated with the Z₁^−/+ and Z₂^−/+ transitions with the activation energies of 592 meV and 650 meV, respectively. The Z₁ and Z₂ defect concentrations are found to increase from 2.1 × 10¹³ to 2.2 × 10¹⁴ cm⁻³ and from 1.2 × 10¹³ to 2.7 × 10¹⁴ cm⁻³, respectively, after the heat treatment of HPSI 4H-SiC samples at 1400 °C for 3 h in Ar ambience. Using the electrical trap-filling pulse, only the thermal two-electron emission from each defect was observed in the epitaxial 4H-SiC through Laplace-transform deep level transient spectroscopy (LDLTS). The activation energies for this process from the Z₁ and Z₂ defects are 587 and 645 meV, respectively, and the defect concentrations are found to be 6.03 × 10¹¹ and 2.64 × 10¹² cm⁻³, respectively. It is postulated that the Z₁ and Z₂ defects are the nearest-neighbor divacancies involving the carbon and silicon vacancies located at mixed, hexagonal (h), and quasi-cubic (k) lattice sites.