The aim of the research was to characterize the soldering alloy In–Ag–Ti type, and to study the direct soldering of SiC ceramics and copper. The In10Ag4Ti solder has a broad melting interval, which mainly depends on its silver content. The liquid point of the solder is 256.5 °C. The solder microstructure is composed of a matrix with solid solution (In), in which the phases of titanium (Ti₃In₄) and silver (AgIn₂) are mainly segregated. The tensile strength of the solder is approximately 13 MPa. The strength of the solder increased with the addition of Ag and Ti. The solder bonds with SiC ceramics, owing to the interaction between active In metal and silicon infiltrated in the ceramics. XRD analysis has proven the interaction of titanium with ceramic material during the formation of the new minority phases of titanium silicide—SiTi and titanium carbide—C₅Ti₈. In and Ag also affect bond formation with the copper substrate. Two new phases were also observed in the bond interphase—(CuAg)₆In₅ and (AgCu)In₂. The average shear strength of a combined joint of SiC–Cu, fabricated with In10Ag4Ti solder, was 14.5 MPa. The In–Ag–Ti solder type studied possesses excellent solderability with several metallic and ceramic materials.

The following study examines the impact of temperature on the deposition of components using Cold Metal Transfer–Wire Arc Additive Manufacturing technology. In the experiment, two overlay weld wall structures were created by applying an interpass temperature of 100 °C and without additional cooling. Subsequently, the microstructural and mechanical properties were observed. No changes in the microstructure due to the application of the interpass temperature were confirmed, and the microstructure of the manufactured components, in both cases, consisted of columnar dendrites. It was found that applying an interpass temperature reduced the average ultimate tensile strength by nearly 65 MPa and the average offset yield strength by 82 MPa. The influence of the cooling strategy on the resulting microstructure was not confirmed. Transmission electron microscopy analysis confirmed the presence of strengthening phases γ′/γ″ in both components; however, a larger amount of the strengthening phase γ″ was found in the component manufactured without the application of an interpass temperature.

The aim of this research was to study the wettability and solderability of SiC ceramics by the use of an active solder of the type Sn5Sb3Ti in a vacuum by electron beam heating. This solder exerts a narrow melting interval, and only one thermal effect, a peritectic reaction, was observed. The liquidus temperature of the solder is approximately 243 °C. The solder consists of a tin matrix where the Ti₆(Sb,Sn)₅ and TiSbSn phases are precipitated. The solder wettability on a SiC substrate decreases with decreasing soldering temperature. The best wetting angle of 33° was obtained in a vacuum at the temperature of 950 °C. The bond between the SiC ceramics and the solder was formed due to the interaction of Ti and Ni with silicon contained in the SiC ceramics. The formation of new TiSi₂ and Ti₃Ni₅Si₆ phases, which form the reaction layer and thus ensure the bond formation, was observed. The bond with Ni is formed due to the solubility of Ni in the tin solder. Two phases, namely the Ni₃Sn₂ and Ni₃Sn phases, were identified in the transition zone of the Ni/Sn5Sb3Ti joint. The highest shear strength, around 40 MPa, was attained at the soldering temperature of 850 °C.

The paper deals with the analysis of mechanical properties of welded joints made of AW 2099 aluminium-lithium alloy by electron beam welding. The thickness of the experimental material was 3±0.2 mm. PZ EZ 30 STU electron beam welding machine was used for production of welds. Maximum accelerating voltage used within this study was 55 kV. Metallographic analysis, hardness measurement test and static tensile were carried out. The structure of the weld joint of aluminium-lithium alloy was investigated. Produced welded joints were characterized by the presence of following zones: heat affected zone (HAZ), equiaxed non-dendritic zone (EQZ), columnar dendritic zone (CDZ) and equiaxed dendritic zone (EDZ). EQZ grains were formed due to heterogeneous nucleation on precipitates at the fusion boundary. EQZ is typical for joining of aluminium lithium alloys.

This paper presents an analysis of weld joint deformation using optical 3D scanning. The weld joints of bimetals were made by explosion welding (EXW). GOM ATOS II TripleScan SO MV320 equipment with measuring volume 320 × 240 × 240 mm, 5.0 MPix camera resolution and GOM ATOS I 350 with a measuring volume of 250 × 200 × 200 mm, 0.8 MPix camera resolution were used for experimental deformation measurements of weldments. The scanned samples were compared with reference specimens. The angular and transverse deformation were visualized by colour deviation maps. The maximum observed deformations of the weld joints ranged from −1.96 to +1.20 mm.

The contribution is dealing with the forging die renovation by hard facing and following machining processes. Deviation of weldment are creating during all types of welding technologies. Shape deviation determining is necessary to purpose of machining and welded layers control quality. The optical scanner ATOS II TripleScan was used to evaluate a quality and deformations of hard facing layers created by fusion welding. Obtained 3D model of the die was used not only for evaluation of quality but also to use as workpiece for CAM simulation of roughing process. The usage of obtained 3D model by ATOS II TripleScan indicate a significant improvement of machining time based on CAQ technology.