Polytetrafluoroethylene (PTFE) plays an important role in semiconductor manufacturing. It is an important processing material for the key sealing components in the field of immersion lithography. The lack of research related to the mechanical processing of PTFE leads to many challenges in producing complex parts. This paper conducted a drilling experiment on PTFE. The effect of cutting parameters on the drilling performance was investigated. Thrust, torque, surface roughness, and drilling temperature were used to evaluate the influence of cutting parameters on drilling performance. In addition, the empirical mathematical models of thrust and torque were developed using analysis of variance (ANOVA). The results indicated that the spindle speed had the most important effect on the thrust and the feed rate had the most significant effect on the torque. The lowest values of thrust and torque were, respectively, 22.64 N and 0.12 Nm, achieved in the case of spindle speed of 5000 rev/min, and feed rate of 50 mm/min. The surface quality is also best at this cutting parameter. Studies have shown that higher spindle speeds with lower feed rates are ideal parameters for improving the drilling performance and machining quality of PTFE. In addition, it was found that the temperature differences due to different drilling depths were related to chip accumulation. Surface roughness inconsistencies at various locations in the inner wall of the hole were influenced by chip adhesion during machining. This paper provides a suggestion for optimizing cutting parameters and hole quality.

Semiconductor cleaning system ultra-clean flow control pumps are critical equipment in the semiconductor industry. Among them, the perfluoroalkoxy alkane (PFA) spring is a pivotal component to control the pump, and its dynamic performance is crucial to ensure the efficient operation of the system. However, the dynamic performance of the spring is often affected by the operating frequency. This paper studied the effect of different working frequencies on the dynamic property of the spring through compression-cycle experiments under uniaxial sinusoidal excitation. The force–displacement curves under different compression frequencies were fitted to obtain the dynamic stiffness of the PFA spring under different cyclic loading frequencies. The variation in the spring’s hysteresis coefficient was evaluated using the hysteresis curves of different cyclic loading conditions. After 2 million compression experiments, the changes in dynamic stiffness, hysteresis coefficient, and spring height were investigated. The obtained results revealed that, as the frequency increases, the dynamic stiffness of the spring increases. The hysteresis coefficient of the PFA spring is the largest at 10 Hz and the smallest at 6 Hz. Upon conducting 2 million compression tests, it was discovered that the dynamic stiffness experiences the greatest attenuation rate of 4.19% at a frequency of 8 Hz, whereas the hysteresis coefficient undergoes the largest attenuation of 42.1% at a frequency of 6 Hz. The results will help to improve the design and application level of PFA springs.

Polytetrafluoroethylene (PTFE) is extensively used in equipment used for manufacturing semiconductor components and wet etching equipment. However, achieving ideal dimensional accuracy when cutting PTFE is challenging. In this study, we performed cutting experiments using a curvilinear tool and analyzed cutting force, cutting temperature, groove width, and surface roughness in PTFE grooving. The results indicated that the cutting force was most notably affected by the feed rate in Stage I of grooving. The rate of change in cutting force was the largest in Stage II because of the increase in the tool contact area. In Stage III, the shear area of the rake face was the largest, and the cutting force tended to be stable. The groove width was measured with a minimum error rate of 0.95% at a feed rate of 0.05 mm/rev. Moreover, the groove exhibited a time—independent springback. The minimum groove surface roughness was 0.586 at a feed rate of 0.05 mm/rev. The ideal feed rate was 0.05 mm/rev with groove width, surface quality, and chip curl as the key parameters. The processing parameters obtained in this study can be applied to actual production for the optimization of manufacturing accuracy.