D flip-flop (DFF) is the basic unit of sequential logic in digital circuits. However, because of an internal cross-coupled inverter pair, it can easily appear as a single event upset (SEU) when hit by high-energy particles, resulting in the error in the value stored in the flip-flop. On this basis, a new structure D flip-flop is proposed in this paper. This flip-flop uses an asymmetric scheme in which the master–slave latch adopts different hardening structures. By sacrificing circuit speed in exchange for stronger SEU fortification capability, the SEU threshold of this structure is improved by 10 times compared to traditional D flip-flops. It has also been compared with Dual Interlocked Storage Elements (DICEs), and it saves the area cost of six transistors compared to the DICE structure. Under the same operating conditions, the average power consumption and peak power consumption are, respectively, 9.8% and 18.8% lower than those of the DICE circuit, making it suitable for soft radiation environments where high circuit speed is not a critical requirement.

In order to improve the ability of the phase-locked loop (PLL) microsystem applied in the aerospace environment to suppress the irradiation effect, this study presents an efficient charge pump hardened scheme by using the radiation-hardened-by-design (RHBD) technology. In this study, the sensitivity analysis of the single-event transient (SET) at different nodes of charge pump and different bombardment energies is carried out. Without changing the original structure and loop parameters, a hardened scheme of phase-locked loop to suppress the single-event effect is proposed. A digital control circuit is added between the charge pump and low-pass filter, which greatly reduces the sensitivity of the charge pump to the SET. The classical double-exponential current pulse model is used to simulate the SET effect on the unreinforced and reinforced phase-locked loops, and the reliability of the proposed reinforcement scheme is verified. The simulation results based on the SMIC 130 nm standard complementary metal–oxide–semiconductor (CMOS) process show that the peak value of the transient response fluctuation of the phase-locked loop using the proposed single-event-hardened scheme decreased by 94.2%, the lock recovery time increased by 75.3%, and the maximum phase shift decreased by 90.8%. This shows that the hardened scheme can effectively reduce the sensitivity of the PLL microsystems to the SET effects.

A voltage-controlled oscillator (VCO) is one of the key modules of the phase-locked loop (PLL) microsystem, and it is easy to bombard using high-energy particles in a radiation environment, resulting in the single-event effect. In order to improve the anti-radiation ability of the PLL microsystems used in the aerospace environment, a new voltage-controlled oscillator hardened circuit is proposed in this work. The circuit consists of delay cells with an unbiased differential series voltage switch logic structure with a tail current transistor. By reducing sensitive nodes and using the positive feedback of the loop, the recovery process of the VCO circuit to the single-event transient (SET) is reduced and accelerated, so as to reduce the sensitivity of the circuit to the single-event effect. The simulation results based on the SMIC 130 nm complementary metal–oxide–semiconductor (CMOS) process show that the maximum phase shift difference of the PLL with the hardened VCO is reduced by 53.5%, which shows that the hardened VCO structure can reduce the sensitivity of the PLL to the SET and improve the reliability of the PLL in the radiation environment.

To improve the reliability of static random access memory (SRAM), error-correcting codes (ECC) are typically used to protect SRAM in the cache. While improving the reliability, we also need additional circuits to support ECC, including encoding and decoding logic. In a high-speed circuit such as a CPU, the L1 cache maintains the same frequency as the CPU, and the decoding of the ECC codes in the cache consumes considerable combinational logic, resulting in limited frequency and performance. This study proposes a high-performance and flexible design scheme with ECC protection in the cache, in which the cache has two working modes: a high-performance mode and a high-reliability mode. The high-performance mode uses simple ECC codes, which can maintain high frequency with low access latency. The high-reliability mode uses more complex ECC codes, which improves the error correction capability and enhances the reliability of the SRAM. To meet the application requirements of different scenarios, the proposed scheme supports the software in switching between the above two modes by configuring the register, which improves the flexibility of the system. The results of synthesis show that the theoretical maximum frequency of proposed ECC design scheme increased from approximately 1.4 GHz in the conventional ECC design scheme to approximately 2.2 GHz. Some of the error correction capability of the high-performance mode is traded off against a 57% increase in frequency. In the high-reliability mode, the error correction capability of the SRAM is enhanced; however, the latency of accessing the cache increases by one cycle.

In this work, a new low voltage-triggered silicon-controlled rectifier named MTSCR is realized in a 65 nm CMOS process for low voltage-integrated circuits electrostatic discharge (ESD) protections. The MTSCR incorporates an external NMOSs-string, which drives the internal NMOS (INMOS) of MTSCR to turn on, and then the INMOS drive SCR structure to turn on. Compared with the existing low trigger voltage (V_t1) ESD component named diodes-string-triggered SCR (DTSCR), the MTSCR can realize the same low V_t1 characteristic but less area penalty of ~44.3% reduction. The results of the transmission line pulsing (TLP) measurement shows that the MTSCR possesses above 2.42 V holding voltage (V_h) and a low V_t1 of ~5.03 V, making it very suitable for the ESD protections for 1.8 V input/output (I/O) ports in CMOS technologies.