Milan Sernek

Prof. Dr. Milan Sernek

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Research Focus & Metrics

Academic Career Length

20Years (2007-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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31 May 2008 in Wood Science and Technology
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Journal Article
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Andreja KutnarAndreja Kutnar
Andreja Kutnar
FKFrederick A. Kamke
Frederick A. Kamke
MSMilan Sernek
Milan Sernek

14 December 2007 in European Journal of Wood and Wood Products
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Journal Article
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MSMilan Sernek
Milan Sernek
MBMichiel Boonstra
Michiel Boonstra
Antonio PizziAntonio Pizzi
Antonio Pizzi
ADAurelien Despres
Aurelien Despres
PGPhilippe Gérardin
Philippe Gérardin

9 April 2021 in Polymers
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Journal Article
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Mirko KarižMirko Kariž
Mirko Kariž
Daša Krapež TomecDaša Krapež Tomec
Daša Krapež Tomec
Sebastian DahleSebastian Dahle
Sebastian Dahle
MKmanja Kuzman
manja Kuzman
MSMilan Sernek
Milan Sernek
JŽJure Žigon
Jure Žigon
Additive manufacturing is becoming increasingly important for manufacturing end products, not just prototyping. However, the size of 3D-printed products is limited due to available printer sizes and other technological limitations. For example, making furniture from 3D-printed parts and wooden elements requires adequate adhesive joints. Since materials for 3D printing usually do not bond very well with adhesives designed for woodworking, they require special surface preparation to improve adhesion. In this study, fused deposition modelling (FDM) 3D-printed parts made of polylactic acid (PLA), polylactic acid with wood flour additive (Wood-PLA), and acrylonitrile-butadiene-styrene (ABS) polymers were bonded to wood with polyvinyl acetate (PVAc) adhesive. The surfaces of the samples were bonded as either non-treated, sanded, plasma treated, or sanded and plasma treated to evaluate the effect of each surface preparation on the bondability of the 3D-printed surfaces. Different surface preparations affected the bond shear strength in different ways. The plasma treatment significantly reduced water contact angles on all tested printing materials and increased the bond tensile shear strength of the adhesive used. The increase in bond strength was highest for the surfaces that had been both sanded and plasma treated. The highest increase was found for the ABS material (untreated 0.05 MPa; sanded and plasma treated 4.83 MPa) followed by Wood-PLA (from 0.45 MPa to 3.96 MPa) and PLA (from 0.55 MPa to 3.72 MPa). Analysis with a scanning electron microscope showed the smooth surfaces of the 3D-printed parts, which became rougher with sanding with more protruded particles, but plasma treatment partially melted the surface structures on the thermoplastic polymer surfaces.

14 May 2020 in Cellulose
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Journal Article
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JŽJure Žigon
Jure Žigon
JKJanez Kovač
Janez Kovač
RZRok Zaplotnik
Rok Zaplotnik
JSJaša Saražin
Jaša Saražin
MSMilan Sernek
Milan Sernek
Sebastian DahleSebastian Dahle
Sebastian Dahle
Combinations of wood and metal are interesting hybrid composite materials, joining together the low density of wood with the stiffness and strength of metals. Different types of adhesives are used to connect wood and metal elements, but the compatibility between adhesives used and load-bearing materials must be sufficient, which often is challenging. In adhesive bonding technology, surface treatments are a crucial step in the process. In this study, an atmospheric plasma discharge was employed to enhance the adhesion strength of joints between common beech (Fagus sylvatica L.) wood, metals (steel and aluminum alloy), and four different types of adhesives. The optical properties of plasma discharges and its influence on treated substrates’ surface morphology depended on the inherent properties of the treated materials. X-ray photoelectron spectroscopy revealed the surface oxidation of all the materials after plasma treatment. Consequently, the surface free energy of all materials increased as well. The positive effect of the plasma treatment on the tensile shear strength of single-lap joints shows a high potential of atmospheric plasma treatment technology for enhancement of adhesives strength of joints combining wooden elements, wood and steel, or wood and aluminum alloys. In addition to that, expensive epoxy and polyurethane adhesives could be replaced by more affordable polyvinyl acetate and melamine-urea-formaldehyde adhesives, and still perform at equal levels if the plasma was applied prior to bonding.

1 January 2022 in Journal of Renewable Materials
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Journal Article
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JSJaša Saražin
Jaša Saražin
IPIda Poljanšek
Ida Poljanšek
APAntonio Pizzi
Antonio Pizzi
MSMilan Sernek
Milan Sernek
The curing process of two biobased adhesives: pine tanninhexamine (TH) and organosolv lignin non-isocyanate polyurethane (NIPU), suitable for interior nonstructural use, were compared with commercial urea-formaldehyde (UF) adhesive. Changes in chemical structure before and after the curing process were observed with Fouriertransform infrared spectroscopy (FTIR). The process of adhesive curing was monitored with differential scanning calorimetry (DSC) and the automated bonding evaluation system (ABES). Both DSC and ABES measurements confirmed UF as the fastest and NIPU as the slowest curing adhesive observed. Taking into account the ABES results, the optimal pressing parameters for the TH adhesive would be 4 min at 175°C, for the NIPU adhesive 7 min at 200°C and for the UF 1.5 min at 100°C. Strong linear correlation was observed between mechanical and chemical curing for the UF and NIPU adhesives, whereas lower correlation was observed for the TH adhesive. At all observed adhesives, the DSC measurements were underestimating the curing process determined by ABES in the first part and overestimating it at the end. The underestimation was the most evident with the TH adhesive and the less with the UF adhesive. When comparing the uncured and cured FTIR spectra of all three types of adhesives, a drastic decrease in the characteristic band of -OH groups at 3330–3400 cm−1 and an increase in the signal intensity at 2920 cm−1 of aliphatic -CH2-groups were observed. For the UF adhesive, the C=O stretching frequency has shifted from 1632 cm−1 for uncured to three different bands at 1766, 1701, and 1655 cm−1 for cured UF. The sharp band for phenolic alcohols at 1236 cm−1 of C–O stretch and hydroxyl O–H functional group at 1009 cm−1 and at 684 cm−1 of uncured TH adhesive diminished during curing, which indicates that a crosslinking reaction occurs via -OH groups. The peak of the C=O group of urethane bridges at 1697 cm−1 for uncured NIPU shifted to lower wavenumber at 1633 cm−1 for cured NIPU.

20 March 2020 in BioResources
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Journal Article
Closed access
MVMatej Vovk
Matej Vovk
MSMilan Sernek
Milan Sernek
An alternative approach to producing a wood-plastic composite (WPC) from wood particles, aluminium trihydrate-filled poly(methyl methacrylate) (PMMA/ATH) waste powder, and melamine-urea-formaldehyde (MUF) resin is described. The surface of PMMA/ATH powder was modified with ureido- and amino-functional silane coupling agents at four different degrees of modification: 0.3%, 0.5%, 1.0%, and 2.0%. An X-ray photoelectron spectroscopy (XPS) analysis was executed on a silane-modified PMMA/ATH material, and the results revealed the presence of chemically bonded silanes on the PMMA/ATH surface. Contact angle measurements were also performed to calculate the surface free energies of the modified powders. Water contact angles of modified powders slightly decreased as surface free energy increased with the degree of surface modification. Mechanical tests of the composites showed that different degrees of surface modification had a significant influence on modulus of elasticity (MOE) and modulus of rupture (MOR) of the composite boards. However, there were no significant differences between the silanes used.