Wetting angles of Sn-8.8Zn and Sn-8.8Zn-xIn alloys (x = 0.5, 1.0, 1.5 wt%) were studied with the sessile drop method. Wetting tests were carried out for 900 s in the presence of ORM0 flux at 493, 523, and 573 K on copper and at 523 K on nickel substrates, respectively. It was found that the addition of In to Sn-8.8Zn alloy improves its wetting on both substrates by reducing the value of apparent wetting angle. Also, with increasing temperature a decrease of wetting angle on copper is observed in the case of 0 and 1.5 wt% of In alloys. Solidified solder-substrate couples were cross-sectioned and examined with scanning electron microscopy coupled with electron dispersive X-ray analysis. Interlayers were found at the interface of solders with copper and nickel, and their compositions are close to Cu₅Zn₈ and Ni₅Zn₂₁ intermetallics, respectively. However, in the case of Sn-8.8Zn-1.5/Ni couple small scallops are observed instead of continuous interlayer.