Epilepsy is a chronic, neurological disorder affecting millions of people every year. The current available pharmacological and surgical treatments are lacking in overall efficacy and cause side-effects like cognitive impairment, depression, tremor, abnormal liver and kidney function. In recent years, the application of optogenetic implants have shown promise to target aberrant neuronal circuits in epilepsy with the advantage of both high spatial and temporal resolution and high cell-specificity, a feature that could tackle both the efficacy and side-effect problems in epilepsy treatment. Optrodes consist of electrodes to record local field potentials and an optical component to modulate neurons via activation of opsin expressed by these neurons. The goal of optogenetics in epilepsy is to interrupt seizure activity in its earliest state, providing a so-called closed-loop therapeutic intervention. The chronic implantation in vivo poses specific demands for the engineering of therapeutic optrodes. Enzymatic degradation and glial encapsulation of implants may compromise long-term recording and sufficient illumination of the opsin-expressing neural tissue. Engineering efforts for optimal optrode design have to be directed towards limitation of the foreign body reaction by reducing the implant’s elastic modulus and overall size, while still providing stable long-term recording and large-area illumination, and guaranteeing successful intracerebral implantation. This paper presents an overview of the challenges and recent advances in the field of electrode design, neural-tissue illumination, and neural-probe implantation, with the goal of identifying a suitable candidate to be incorporated in a therapeutic approach for long-term treatment of epilepsy patients.

NMOS-based Integrated Modular Bypass for Use in Solar systems (NIMBUS) is designed as a replacement for the traditional bypass diode, used in common solar panels. Because of the series connection between the individual solar cells, the power output of a photovoltaic (PV) panel will drop disproportionally under partial shading. Currently, this is solved by dividing the PV panel into substrings, each with a diode bypass placed in parallel. This allows an alternative current path. However, the diodes still have a significant voltage drop (about 350 mV), and due to the fairly large currents in a panel, the diodes are dissipating power that we would rather see at the output of the panel. The NIMBUS chip, being a low-voltage-drop switch, aims to replace these diodes and, thus, reduce that power loss. NIMBUS is a smart bypass: a completely stand-alone system that detects the failing of one or more cells and activates when necessary. It is designed for a 100-mV voltage drop under a 5-A load current. When two or more NIMBUS chips are placed in parallel, an internal synchronization circuit ensures proper operation to provide for larger load currents. This paper will elaborate on the operation, design and implementation of the NIMBUS chip, as well as on the first measurements.

The smart textiles and wearable technology markets are expanding tirelessly, looking for efficient solutions to create long-lasting products. The research towards novel integration methods and increasing reliability of wearables and electronic textiles (e-textiles) is expanding. One obstacle to be tackled is the washability and the endurance to mechanical stresses in the washing machine. In this article, different layering of thermoplastic polyurethane (TPU) films and knit fabrics are used to integrate three different designs of stretchable copper-based meander tracks with printed circuit boards. The various combinations are washed according to the ISO 6330-2012 standard to analyze their endurance. Results suggest that one meander design withstands more washing cycles and indicate that the well-selected layer compositions increase the reliability. Higher stretchability together with greater durability is accomplished by adding an extra meander-shaped TPU film layer.

This study presents a novel approach to manufacture a rigid printed circuit board (PCB) using sustainable polymers. Current PCBs use a fossil-fuel-based substrate, like FR4. This presents recycling challenges due to its composite nature. Replacing the substrate with an environmentally friendly alternative leads to a reduction in negative impacts. Polylactic acid (PLA) and Polyhydroxybutyrate (PHB) biopolymers are used in this study. These two biopolymers have low melting points (130–180 °C, and 170–180 °C, respectively) and cannot withstand the high temperature soldering process (up to 260 °C for standard SAC (SnAgCu, tin/silver/copper) lead free solder processes). Our approach for replacing the PCB substrate is applying the PLA/PHB carrier substrate at the end of the PCB manufacturing process using injection molding technology. This approach involves all the standard PCB processes, including wet etching of the Cu conductors, and component assembly with SAC solder on a thin flexible polyimide (PI) foil with patterned Cu conductors and then overmolding the biopolymer onto the foil to create a rigid base. This study demonstrates the functionality of two test circuits fabricated using this method. In addition, we evaluated the adhesion between the biopolymer and PI to achieve a durable PCB. Moreover, we performed two different end-of-life approaches (debonding and composting) as a part of the end-of-life consideration. By incorporating biodegradable materials into PCB standard manufacturing, the CO₂ emissions and energy consumption are significantly reduced, and installation costs are lowered.