Using microfluidic cooling to achieve thermal management of three-dimensional integrated circuits (ICs) is recognized as a promising method of extending Moore law progression in electronic components and systems. Since the U.S. Defense Advanced Research Projects Agency launched Intra/Inter Chip Enhanced Cooling thermal packaging program, the method of using microfluidic cooling in 3D ICs has been under continuous development. This paper presents an analysis of all publications available about the microfluidic cooling technologies used in 3D IC thermal management, and summarized these research works into six categories: cooling structure design, co-design issues, through silicon via (TSV) influence, specific chip applications, thermal models, and non-uniform heating and hotspots. The details of these research works are given, future works are suggested.

Microfluidics offer microenvironments for reagent delivery, handling, mixing, reaction, and detection, but often demand the affiliated equipment for liquid control for these functions. As a helpful tool, the capillary pressure control valve (CPCV) has become popular to avoid using affiliated equipment. Liquid can be handled in a controlled manner by using the bubble pressure effects. In this paper, we analyze and categorize the CPCVs via three determining parameters: surface tension, contact angle, and microchannel shape. Finally, a few application scenarios and impacts of CPCV are listed, which includes how CPVC simplify automation of microfluidic networks, work with other driving modes; make extensive use of microfluidics by open channel, and sampling and delivery with controlled manners. The authors hope this review will help the development and use of the CPCV in microfluidic fields in both research and industry.

Herein, we demonstrate that lithium and cobalt co-doped NiO_x hole transport layers can greatly enhance the device performance of inverted planar heterojunction perovskite solar cells.

A novel inverse photoconductivity horizon in perovskite photo-memristor applications with various iodine concentrations, electrodes, and modified layers.