We investigated the effect of phase separation on the Schottky barrier height (SBH) of InAlAs layers grown by metal–organic chemical vapor deposition. The phase separation into the In-rich InAlAs column and Al-rich InAlAs column of In_0.52Al_0.48As layers was observed when we grew them at a relatively low temperature of below 600 °C. From the photoluminescence spectrum investigation, we found that the band-gap energy decreased from 1.48 eV for a homogeneous In_0.52Al_0.48As sample to 1.19 eV for a phase-separated In_xAl_1−xAs sample due to the band-gap lowering effect by In-rich In_xAl_1−xAs (x > 0.7) region. From the current density–voltage analysis of the InAlAs Schottky diode, it was confirmed that the phase-separated InAlAs layers showed a lower SBH value of about 240 meV than for the normal InAlAs layers. The reduction in SBH arising from the phase separation of InAlAs layers resulted in the larger leakage current in InAlAs Schottky diodes.

Our investigation focused on assessing the influence of the metamorphic buffer in metamorphic high-electron-mobility transistors (MHEMT) that were grown on GaAs substrates. While an MHEMT exhibited elevated off-state current levels, its direct current (DC) and radio frequency (RF) traits were found to be comparable to those of InP-based lattice-matched high-electron-mobility transistors (LM-HEMTs). However, the Pulsed I–V measurement results confirmed the presence of the fast transient charging effect, leading to a more substantial degradation in drain current observed in MHEMT. In addition, through the low-frequency noise characteristics, it was confirmed that the dominant trapping location was located in the bulk site. The slope of the 1/f noise measurement indicated that the primary trapping site was in proximity to the bulk traps. The carrier-number-fluctuation (CNF) model was employed to extract the bulk trap density (N_t). For the LM-HEMTs, the value was at 3.27 × 10¹⁶ eV⁻¹·cm⁻³, while for the MHEMT, it was 3.56 × 10¹⁷ eV⁻¹·cm⁻³.

In this paper, we reported changes in the growth morphology of n+InAs nanowires (NWs) doped with Te which were selectively grown on nano-hole patterned InP(111)B substrates using an MOCVD method. While the vertical growth of InAs NWs in the direction was extremely suppressed, their lateral growth was enhanced when the diethyl-tellurium (DETe) flow rate was increased as they grew. Moreover, the sidewall planes evolved from ($1\overline{1}0$) (90° against the (111) plane) to a reverse-tapered morphology, which had a 62° slope against the InP (111)B plane, when the Te flow rate and growth time were increased. This indicates that the surfactant effect of adsorbed Te atoms on InAs changes the relative growth rate between (111) and ($1\overline{1}0$) due to the increase in surface free energy in the growth plane.

In this paper, we report the fabrication and characterization of L_g = 50 nm Gate-All-Around (GAA) In_0.53Ga_0.47As nanosheet (NS) metal-oxide-semiconductor field-effect transistors (MOSFETs) with sub-20 nm nanosheet thickness that were fabricated through an S/D regrowth process. The fabricated GAA In_0.53Ga_0.47As NS MOSFETs feature a bi-layer high-k dielectric layer of Al₂O₃/HfO₂, together with an ALD-grown TiN metal-gate in a cross-coupled manner. The device with L_g = 50 nm, W_NS = 200 nm and t_NS = 10 nm exhibited an excellent combination of subthreshold-swing behavior (S < 80 mV/dec.) and carrier transport properties (g_{m_max} = 1.86 mS/μm and I_ON = 0.4 mA/μm) at V_DS = 0.5 V. To the best of our knowledge, this is the first demonstration of In_xGa_1-xAs GAA NS MOSFETs that would be directly applicable for their use in future multi-bridged channel (MBC) devices.