This work experimentally investigated the wake-up behaviors of hafnium oxide-based ferroelectric capacitors by manipulating the interval time between each characterization cycle. Both Positive-Up–Negative-Down (PUND) and Negative-Down–Positive-Up (NDPU) waveforms were used as the stress and measurement waveforms in the experiments. It was found that the imprint occurs as the total interval time increases to a several-seconds level. However, this only affects the remnant polarization (P_R) of ferroelectric capacitors when stressed by NDPU waveforms, since the voltage amplitude saturates under the PUND stress conditions and does not influence the P_R. The wake-up behavior has been proved to be caused by the defects redistribution during electrical cycling. Notably, when using PUND waveforms, the change in the interval time can result in different increase rates of P_R, indicating the possibility of recovery during the intervals. This recovery leads to a slower wake-up when cycling with a longer interval time. Moreover, it is observed that this P_R recovery could reach saturation after several seconds of the interval time. This comprehensive investigation of wake-up and imprint behaviors can provide new insights to evaluate and enhance the reliability of ferroelectric memories.

As semiconductor devices approach the sub-10 nm technology node, the self-heating effect (SHE) induced by confined geometries (e.g., FinFETs and nanosheet FETs) has emerged as a critical bottleneck affecting both performance and reliability. This challenge has prompted extensive research efforts to develop advanced characterization methodologies to investigate this effect and its corresponding influence on the device’s reliability issues. In this paper, we propose reflection-based ultra-fast measurement techniques for the continuous monitoring of the self-heating effect in advanced MOSFETs. With this approach, the self-heating effect-induced degradation of transistor drain current and the real-time temperature change can be continuously captured using a digital phosphor oscilloscope on a nanosecond scale. The thermal time constant of 17 ns and the thermal resistance of 34,000 K/W have been extracted for the short channel transistors used in this study with the help of this new characterization method. This reflection-based method is useful for the fast extraction of the thermal time constant and thermal resistance and for the continuous monitoring of current degradation as well as the real-time temperature. Therefore, this new characterization method is beneficial for the evaluation of the self-heating effect in advanced ultra-scaled MOSFETs.

The conventional static imprint effect in Hf_xZr_1−xO₂ (HZO) ferroelectric (FE) devices, which degrades data retention, is generally characterized by a shift in the hysteresis loop along the electric field axis. Unlike the static imprint effect, the dynamic imprint effect emerges under dynamic electric fields or actual operating conditions, making the FE film exceptionally sensitive to switching pulse parameters and domain history. In HZO anti-ferroelectric (AFE) devices, this dynamic imprint effect alters the coercive field distribution associated with domain switching and poses a significant challenge to long-term stable device operation. This study systematically investigates the dynamic imprint effect and its recovery process using a comprehensive integration of first-order reversal curve (FORC) analysis, transient current-voltage (I-V), and polarization-voltage (P-V) characterization. By analyzing localized imprint behavior under sub-cycling conditions, mechanisms and recovery pathways of imprint in AFE devices are proposed. Finally, possible physics-based mechanisms describing imprint behaviors and recovery behaviors are discussed, providing insights for optimizing AFE memory technology performance and reliability.