Xindong Huang

Mr. Xindong Huang


Research Focus & Metrics

Academic Career Length

2Years (2025-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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15 May 2025 in Electronics
Verified
Journal Article
Open access
PDF file
QGQiaoying Gan
Qiaoying Gan
WZWeiyi Zheng
Weiyi Zheng
ZCZhifeng Chen
Zhifeng Chen
YZYuyan Zhang
Yuyan Zhang
Chengying ChenChengying Chen
Chengying Chen
XHXindong Huang
Xindong Huang
As a critical component of computer systems, static random access memory (SRAM) plays a significant role in the fields of high-performance computing, artificial intelligence, and the Internet of Things. However, the conventional silicon-based SRAM is facing problems such as high power consumption, integration limitations, and the need for performance improvement. For the power consumption challenge of SRAM, a novel read/write-decoupled SRAM cell is proposed in this paper. When SRAM is in a standby state, utilization of this cell can effectively reduce the leakage current, thereby reducing the static power consumption. In addition, a novel carbon–silicon heterogeneous-integrated SRAM technology is proposed in this paper. The carbon–silicon heterogeneous-integrated SRAM technology combines the high mobility, low power consumption, and low temperature process compatibility of carbon nanotubes (CNTs) with mature silicon-based fabrication processes, enabling significant optimization of access time and power consumption. The SRAM was implemented by a silicon-based 55 nm process and a carbon-based 500 nm process. The simulation results showed that when the power supply was 1.2 V, the access time of SRAM with the silicon 55 nm process was 886 ps. The static and dynamic power consumption was 91.51 nW and 1.48 mW, respectively. The SRAM with carbon–silicon heterogeneous-integrated technology achieved an access time of 872 ps, a static power consumption of 62.54 nW, and a dynamic power consumption of 1.07 mW, representing reductions of 1.58%, 31.66%, and 27.70%, respectively.

20 May 2025 in Sensors
Verified
Journal Article
Open access
PDF file
XHXindong Huang
Xindong Huang
CCChengying Chen
Chengying Chen
SZShaokang Zhou
Shaokang Zhou
This paper presents an RF switch chip with a wide operating bandwidth from 6 to 18 GHz, designed for RF front-end applications in mobile communications. A series-parallel topology combined with a stacked transistor structure was employed to improve power handling while maintaining low insertion loss and high isolation. To further optimize isolation and return loss, LC resonant circuits were introduced by utilizing off-state transistors as capacitive elements. Compared to existing designs, the proposed switch achieved an improved trade-off between bandwidth, power capacity, and port performance. Measurement results showed insertion loss below 1.917 dB, isolation above 38.839 dB, return loss better than 13.075 dB, and 1 dB input compression point above 32 dBm at 12 GHz, confirming the effectiveness and novelty of the broadband design.