High-entropy alloys (HEAs) gained interest in the field of biomedical applications due to their unique effects and to the combination of the properties of the constituent elements. In addition to the required property of biocompatibility, other requirements include properties such as mechanical resistance, bioactivity, sterility, stability, cost effectiveness, etc. For this paper, a biocompatible high-entropy alloy, defined as bio-HEA by the literature, can be considered as an alternative to the market-available materials due to their superior properties. According to the calculation of the valence electron concentration, a majority of body-centered cubic (BCC) phases were expected, resulting in properties such as high strength and plasticity for the studied alloy, confirmed by the XRD analysis. The tetragonal (TVC) phase was also identified, indicating that the presence of face-centered cubic (FCC) phases in the alloyed materials resulted in high ductility. Microstructural and compositional analyses revealed refined and uniform metallic powder particles, with a homogeneous distribution of the elemental particles observed from the mapping analyses, indicating that alloying had occurred. The technological characterization of the high-entropy alloy-elaborated powder revealed the particle dimension reduction due to the welding and fracturing process that occurs during mechanical alloying, with a calculated average particle size of 45.12 µm.

The aim of this paper is to establish the cost-effectiveness of high-entropy alloy coatings, using the electrospark deposition technique, designed for a geothermal turbine blade’s leading edge. The deposition of materials with high resistance to corrosion and erosion aims to increase the blade’s service life, reduce maintenance costs and improve production efficiency. According to our previous research on the CoCrFeNiMo_x high-entropy alloy system, the results showed a high corrosion resistance when in bulk or as a coating, and when tested in geothermal steam and in a saline solution. Based on the results, the high-entropy alloy was subjected to further analyses. The paper focused on two aspects of the research. The first direction was to explore the possibility of obtaining an effective, protective high-entropy alloy layer by the electrospark deposition method. To this end, various tests were performed to demonstrate that the new material possesses superior properties and is suitable for the geothermal environment’s demands. The second direction was to calculate the economic efficiency of coating the areas intensely subjected to wear, based on reports published by the geothermal power plants’ representatives. The final costs were compared with the commercially available equipment parts, and also with the general maintenance costs. From the calculation of the cost efficiency for the CoCrFeNiMo_0.85 high-entropy alloy, it resulted that the deposition method and the properties of the material are suitable for the operating conditions, representing an efficient and easy to apply solution to reduce maintenance costs in the geothermal industry.

The Bi-Sn, Bi-Sn-Ag, and Bi-Sn-Sb solder alloy systems represent lead-free, environmentally friendly alternatives for reliable electronic assembly. These alloys comply with increasingly strict environmental and health regulations, while offering low melting points suitable for soldering temperature-sensitive components. Microstructural analysis revealed distinct phase segregation in all alloys, with Sb promoting coarse Sn₂Sb₃ intermetallic compounds and Ag inducing fine needle-like Ag₃Sn precipitates. Eutectic refinement and compositional contrast were confirmed by SEM-BSE and EDS mapping. Vickers microhardness measurements revealed increased hardness in Sb- and Ag-modified Bi–Sn alloys, with Ag₃Sn dispersion yielding the highest strengthening effect, indicating enhanced mechanical potential. This study also reports the thermal and electrical conductivities of Bi60Sn40, Bi60Sn35Ag5, and Bi60Sn35Sb5 alloys over the 25–140 °C range. Bi60Sn40 showed an increase in thermal conductivity across the full temperature range from 16.93 to 26.93 W/m·K, while Bi60Sn35Ag5 reached 18.28 W/m·K at 25 °C, and Bi60Sn35Sb5 exhibited 13.90 W/m·K. These findings underline the critical influence of alloying elements on microstructure, phase stability, and thermophysical behavior, supporting their application in low-temperature soldering technologies.

Alloys with superior properties represent the main topic of recent studies due to their effectiveness in reducing the cost of equipment maintenance and enhancing usage time, in addition to other benefits in domains such as geothermal, marine, and airspace. Al_0.5CrFeNiTi was produced by solid state processing in a planetary ball mill, with the objective of obtaining a high alloying degree and a homogenous composition that could be further processed by pressing and sintering. The metallic powder was technologically characterized, indicating a particle size reduction following mechanical alloying processing when compared to the elemental raw powder materials. The microstructural analysis presented the evolution of the alloying degree during milling but also a compact structure with no major defects in the pressed and sintered bulk samples. The X-ray diffraction results confirmed the presence of face-centered cubic (FCC) and body-centered cubic (BCC) phases, predicted by the theoretical calculations, along with a hexagonal close-packed (HCP) phase, where the Al, Cr, Fe, Ni, and Ti phase was identified in both the alloyed powder material and sintered sample.

The Bi-Sn, Bi-Sn-Ag, and Bi-Sn-Sb solder alloy systems represent lead-free, environmentally friendly alternatives for reliable electronic assembly. These alloys comply with increasingly strict environmental and health regulations, while offering low melting points suitable for soldering temperature-sensitive components. The addition of Ag or Sb improves mechanical strength, hardness, wear resistance, and thermal stability. Microstructural analysis confirmed homogeneous, defect-free surfaces. Comprehensive microstructural characterization using optical microscopy, SEM, EDS, and BSE imaging revealed refined, heterogeneous microstructures with distinct phase segregation. Dendritic growth, eutectic formations, and intermetallic compounds were observed. Sb addition promoted granular intermetallics, while Ag induced needle-like precipitates along phase boundaries. EDS confirmed expected compositions, and BSE imaging enhanced contrast between Bi-, Sn-, Sb-, and Ag-rich regions. The study also reports the thermal and electrical conductivities of Bi60Sn40, Bi60Sn35Ag5, and Bi60Sn35Sb5 alloys over the 25–140 °C range. Bi60Sn40 showed an increase in thermal conductivity from 16.93 to 26.93 W/m·K, while Bi60Sn35Ag5 reached 18.28 W/m·K at 25 °C, and Bi60Sn35Sb5 exhibited 13.89 W/m·K. These findings underline the critical influence of alloying elements on microstructure, phase stability, and thermophysical behavior, supporting their application in low-temperature soldering technologies.