Chuan Chen received a B.S. degree in automation from the Beijing University of Science and Technology, Beijing, China, in 2012, an M.Sc. degree from the Institute of Microelectronics, Tsinghua University, Beijing, China, in 2015, and a Ph.D. degree from the Institute of Microelectronics, Chinese Academy of Sciences, Beijing, China, in 2020. Between 2015 and 2017, he was engaged in DFX research as an assistant engineer at Huawei Technologies Co., Ltd. He has been working at the Institute of Microelectronics of the Chinese Academy of Sciences as an Associate Researcher from 2022 to the present. His research interests include thermal management of advanced packaging, high-power cooling technology, system integration, and reliability study.